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Applied Scanning Probe Methods X: Biomimetics and Industrial Applications 2008 ed. [Kietas viršelis]

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  • Formatas: Hardback, 427 pages, aukštis x plotis: 235x155 mm, weight: 898 g, LIX, 427 p., 1 Hardback
  • Serija: NanoScience and Technology
  • Išleidimo metai: 11-Jan-2008
  • Leidėjas: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • ISBN-10: 3540740848
  • ISBN-13: 9783540740841
Kitos knygos pagal šią temą:
  • Formatas: Hardback, 427 pages, aukštis x plotis: 235x155 mm, weight: 898 g, LIX, 427 p., 1 Hardback
  • Serija: NanoScience and Technology
  • Išleidimo metai: 11-Jan-2008
  • Leidėjas: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • ISBN-10: 3540740848
  • ISBN-13: 9783540740841
Kitos knygos pagal šią temą:
The success of the Springer Series Applied Scanning Probe Methods IVII and the rapidly expanding activities in scanning probe development and applications worldwide made it a natural step to collect further speci c results in the elds of development of scanning probe microscopy techniques (Vol. VIII), characterization (Vol. IX), and biomimetics and industrial applications (Vol. X). These three volumes complement the previous set of volumes under the subject topics and give insight into the recent work of leading specialists in their respective elds. Following the tradition of the series, the chapters are arranged around techniques, characterization and biomimetics and industrial applications. Volume VIII focuses on novel scanning probe techniques and the understanding of tip/sample interactions. Topics include near eld imaging, advanced AFM, s- cializedscanningprobemethodsinlifesciencesincludingnewselfsensingcantilever systems, combinations of AFM sensors and scanning electron and ion microscopes, calibration methods, frequency modulation AFM for application in liquids, Kelvin probe force microscopy, scanning capacitance microscopy, and the measurement of electrical transport properties at the nanometer scale. Vol. IX focuses on characterization of material surfaces including structural as well as local mechanical characterization, and molecular systems. The volume covers a broad spectrum of STM/AFM investigations including fullerene layers, force spectroscopy for probing material properties in general, biological lms .and cells, epithelial and endothelial layers, medical related systems such as amyloidal aggregates, phospholipid monolayers, inorganic lms on aluminium and copper - ides,tribological characterization, mechanical properties ofpolymernanostructures,technical polymers, and near eld optics.
27 Gecko Feet: Natural Attachment Systems for Smart Adhesion—Mechanism, Modeling, and Development of Bio-Inspired Materials
Bharat Bhushan, Robert A. Sayer
1
27.1 Introduction
1
27.2 Tokay Gecko
2
27.2.1 Construction of Tokay Gecko
2
27.2.2 Other Attachment Systems
5
27.2.3 Adaptation to Surface Roughness
7
27.2.4 Peeling
8
27.2.5 Self-Cleaning
10
27.3 Attachment Mechanisms
12
27.3.1 Van der Waals Forces
12
27.3.2 Capillary Forces
13
27.4 Experimental Adhesion Test Techniques and Data
14
27.4.1 Adhesion Under Ambient Conditions
15
27.4.2 Effects of Temperature
17
27.4.3 Effects of Humidity
18
27.4.4 Effects of Hydrophobicity
18
27.5 Adhesion Modeling
19
27.5.1 Spring Model
21
27.5.2 Single Spring Contact Analysis
21
27.5.3 The Multilevel Hierarchical Spring Analysis
23
27.5.4 Adhesion Results for the Gecko Attachment System Contacting a Rough Surface
26
27.5.5 Capillarity Effects
30
27.5.6 Adhesion Results that Account for Capillarity Effects
31
27.6 Modeling of Biomimetic Fibrillar Structures
34
27.6.1 Fiber Model
34
27.6.2 Single Fiber Contact Analysis
34
27.6.3 Constraints
35
27.6.4 Numerical Simulation
39
27.6.5 Results and Discussion
41
27.7 Fabrication of Biomimetric Gecko Skin
48
27.7.1 Single-Level Hierarchical Structures
49
27.7.2 Multilevel Hierarchical Structures
53
27.8 Closure
55
Appendix
56
References
59
28 Carrier Transport in Advanced Semiconductor Materials
Filippo Giannazzo, Patrick Fiorenza, Vito Raineri
63
28.1 Majority Carrier Distribution in Semiconductors: Imaging and Quantification
64
28.1.1 Basic Principles of SCM
64
28.1.2 Carrier Imaging Capability by SCM
67
28.1.3 Quantification of SCM Raw Data
70
28.1.4 Basic Principles of SSRM
78
28.1.5 Carrier Imaging Capability by SSRM
81
28.1.6 Quantification of SSRM Raw Data
81
28.1.7 Drift Mobility by SCM and SSRM
85
28.2 Carrier Transport Through Metal–Semiconductor Barriers by C-AFM
88
28.3 Charge Transport in Dielectrics by C-AFM
93
28.3.1 Direct Determination of Breakdown
97
28.3.2 Weibull Statistics by C-AFM
99
28.4 Conclusion
101
References
101
29 Visualization of Fixed Charges Stored in Condensed Matter and Its Application to Memory Technology
Yasuo Cho
105
29.1 Introduction
105
29.2 Principle and Theory for SNDM
106
29.3 Microscopic Observation of Area Distribution of the Ferroelectric Domain Using SNDM
107
29.4 Visualization of Stored Charac in Semiconductor Hash Memories Using SNDM
109
29.5 Higher-Order SNDM
110
29.6 Noncontact SNDM
111
29.7 SNDM for 3D Observation of Nanoscale Ferroelectric Domains
112
29.8 Next-Generation Ultra-High-Density Ferroelectric Data Storage Based on SNDM
114
29.8.1 Overview of Ferroelectric Data Storage
114
29.8.2 SNDM Nanodomain Engineering System and Ferroelectric Recording Medium
116
29.8.3 Nanodomain Formation in a LiTaO3 Single Crystal
117
29.8.4 High-Speed Switching of Nanoscale Ferroelectric Domains in Congruent Single-Crystal LiTaO3
120
29.8.5 Prototype of a High-Density Ferroelectric Data Storage System
122
29.8.6 Realization of 10 Tbit/in.2 Memory Density
126
29.9 Outlook
128
References
129
30 Applications of Scanning Probe Methods in Chemical Mechanical Planarization
Toshi Kasai, Bharat Bhushan
131
30.1 Overview of CMP Technology and the Need for SPM
131
30.1.1 CMP Technology and Its Key Elements
131
30.1.2 Various CMP Processes and the Need for SPM
134
30.2 AFP for the Evaluation of Dishing and Erosion
137
30.3 Surface Planarization and Roughness Characterization in CMP Using AFM
141
30.4 Use of Modified Atomic Force Microscope Tips for Fundamental Studies of CMP Mechanisms
144
30.5 Conclusions
149
References
149
31 Scanning Probe Microscope Application for Single Molecules in a π-Conjugated Polymer Toward Molecular Devices Based on Polymer Chemistry
Ken-ichi Shinohara
153
31.1 Introduction
153
31.2 Chiral Helical π-Conjugated Polymer
154
31.2.1 Helical Chirality of a π-Conjugated Main Chain Induced by Polymerization of Phenylacetylene with Chiral Bulky Groups
156
31.2.2 Direct Measurement of the Chiral Quaternary Structure in a π-Conjugated Polymer
158
31.2.3 Direct Measurement of Structural Diversity in Single Molecules of a Chiral Helical π-Conjugated Polymer
163
31.2.4 Dynamic Structure of Single Molecules in a Chiral Helical π-Conjugated Polymer by a High-Speed AFM
166
31.3 Supramolecular Chiral π-Conjugated Polymer
169
31.3.1 Simultaneous Imaging of Structure and Fluorescence of a Supramolecular Chiral π-Conjugated Polymer
169
31.3.2 Dynamic Structure of a Supramolecular Chiral π-Conjugated Polymer by a High-Speed AFM
177
References
181
32 Scanning Probe Microscopy on Polymer Solar Cells
Joachim Loos, Alexander Alexeev
183
32.1 Brief Introduction to Polymer Solar Cells
184
32.2 Sample Preparation and Characterization Techniques
188
32.3 Morphology Features of the Photoactive Layer
190
32.3.1 Influence of Composition and Solvents on the Morphology of the Active Layer
190
32.3.2 Influence of Annealing
193
32.3.3 All-Polymer Solar Cells
199
32.4 Nanoscale Characterization of Properties of the Active Layer
201
32.4.1 Local Optical Properties As Measured by Scanning Near-Field Optical Microscopy
201
32.4.2 Characterization of Nanoscale Electrical Properties
203
32.5 Summary and Outlook
212
References
213
33 Scanning Probe Anodization for Nanopatterning
Hiroyuki Sugimura
217
33.1 Introduction
217
33.2 Electrochemical Origin of SPM-Based Local Oxidation
218
33.3 Variation in Scanning Probe Anodization
223
33.3.1 Patternable Materials in Scanning Probe Anodization
223
33.3.2 Environment Control in Scanning Probe Anodization
226
33.3.3 Electrochemical Scanning Surface Modification Using Cathodic Reactions
229
33.4 Progress in Scanning Probe Anodization
232
33.4.1 From STM-Based Anodization to AFM-Based Anodization
232
33.4.2 Versatility of AFM-Based Scanning Probe Anodization
233
33.4.3 In Situ Characterization of Anodized Structures by AFM-Based Methods
233
33.4.4 Technical Development of Scanning Probe Anodization
237
33.5 Lithographic Applications of Scanning Probe Anodization
239
33.5.1 Device Prototyping
239
33.5.2 Pattern Transfer from Anodic Oxide to Other Materials
240
33.5.3 Integration of Scanning Probe Lithography with Other High-Throughput Lithographies
247
33.5.4 Chemical Manipulation of Nano-objects by the Use of a Nanotemplate Prepared by Scanning Probe Anodization
248
33.6 Conclusion
251
References
251
34 Tissue Engineering: Nanoscale Contacts in Cell Adhesion to Substrates
Mario D'Acunto, Paolo Giusti, Franco Maria Montevecchi, Gianluca Ciardelli
257
34.1 Tissue Engineering: A Brief Introduction
257
34.2 Fundamental Features of Cell Motility and Cell—Substrates Adhesion
261
34.2.1 Biomimetic Scaffolds, Roughness, and Contact Guidance for Cell Adhesion and Motility
268
34.3 Experimental Strategies for Cell—ECM Adhesion Force Measurements
271
34.4 Conclusions
279
34.5 Glossary
279
References
280
35 Scanning Probe Microscopy in Biological Research
Tatsuo Ushiki, Kazushige Kawabata
285
35.1 Introduction
285
35.2 SPM for Visualization of the Surface of Biomaterials
286
35.2.1 Advantages of AFM in Biological Studies
286
35.2.2 AFM of Biomolecules
287
35.2.3 AFM of Isolated Intracellular and Extracellular Structures
289
35.2.4 AFM of Tissue Sections
292
35.2.5 AFM of Living Cells and Their Movement
292
35.2.6 Combination of AFM with Scanning Near-Field Optical Microscopy for Imaging Biomaterials
294
35.3 SPM for Measuring Physical Properties of Biomaterials
296
35.3.1 Evaluation Methods of Viscoelasticity
296
35.3.2 Examples for Viscoelasticity Mapping Measurements
299
35.3.3 Combination of Viscoelasticity Measurement with Other Techniques
302
35.4 SPM as a Manipulation Tool in Biology
304
35.5 Conclusion
306
References
306
36 Novel Nanoindentation Techniques and Their Applications
Jiping Ye
309
36.1 Introduction
309
36.2 Basic Principles of Contact
311
36.2.1 Meyer's Law
311
36.2.2 Elastic Contact Solution
312
36.3 Tip Rigidity and Geometry
313
36.4 Hardness and Modulus Measurements
314
36.4.1 Analysis Method
314
36.4.2 Practical Application Aspects
316
36.4.3 Recent Applications
320
36.5 Yield Stress and Modulus Measurements
324
36.5.1 Analysis Method
324
36.5.2 Recent Applications
326
36.6 Work-Hardening Rate and Exponent Measurements
329
36.6.1 Analysis Method
329
36.6.2 Practical Application Aspects
333
36.6.3 Recent Applications
335
36.7 Viscoelastic Compliance and Modulus
336
36.7.1 Analysis Method
336
36.7.2 Practical Application Aspects
339
36.8 Other Mechanical Characteristics
342
36.9 Outlook
343
References
343
37 Applications to Nano-Dispersion Macromolecule Material Evaluation in an Electrophotographic Printer
Yasushi Kadola
347
37.1 Introduction
347
37.2 Electrophotographic Processes
348
37.2.1 Principle and Characteristics of an Electrophotographic System
348
37.2.2 Microcharacteristic and Analysis Technology for Functional Components
349
37.3 SPM Applications to Electrophotographic Systems
352
37.3.1 Measurement of Electrostatic Charge of Toner
352
37.3.2 Measurement of the Adhesive Force Between a Particle and a Substrate
353
37.3.3 Observation of a Nanodispersion Macromolecule Interface —Toner Adhesion to a Fusing Roller
355
37.4 Current Technology Subjects
357
References
357
38 Automated AFM as an Industrial Process Metrology Tool for Nanoelectronic Manufacturing
Tianming Bao, David Fong, Sean Hand
359
38.1 Introduction
359
38.2 Dimensional Metrology with AFM
361
38.2.1 Dimensional Metrology
361
38.2.2 AFM Scanning Technology
362
38.2.3 AFM Probe Technology
367
38.2.4 AFM Metrology Capability
367
38.3 Applications in Semiconductors Logic and Memory Integrated Circuits
370
38.3.1 Shallow Trench Isolation Resist Pattern
370
38.3.2 STI Etch
372
38.3.3 STI CMP
375
38.3.4 Gate Resist Pattern
378
38.3.5 Gate Etch
379
38.3.6 FinFET Gate Formation
383
38.3.7 Gate Sidewall Spacer
385
38.3.8 Strained SiGe Source/Drain Recess
385
38.3.9 Pre-metal Dielectric CMP
386
38.3.10 Contact and Via Photo Pattern
387
38.3.11 Contact Etch
387
38.3.12 Contact CMP
389
38.3.13 Metal Trench Photo Pattern
390
38.3.14 Metal Trench Etch
390
38.3.15 Via Etch
392
38.3.16 Via Etch
394
38.3.17 Roughness
396
38.3.18 LWR, LER, and SWR
397
38.3.19 DRAM DT Capacitor
397
38.3.20 Ferroelectric RAM Capacitor
398
38.3.21 Optical Proximity Correction
398
38.4 Applications in Photomask
399
38.4.1 Photomask Pattern and Etch
399
38.4.2 Photomask Defect Review and Repair
400
38.5 Applications in Hard Disk Manufacturing
401
38.5.1 Magnetic Thin-Film Recording Head
401
38.5.2 Slider for Hard Drive
405
38.6 Applications in Microelectromechanical System Devices
406
38.6.1 Contact Image Sensor
406
38.6.2 Digital Light Processor Mirror Device
408
38.7 Challenge and Potential Improvement
408
38.8 Conclusion
409
References
411
Subject Index 413