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Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC [Kietas viršelis]

  • Formatas: Hardback, 384 pages, aukštis x plotis x storis: 244x163x31 mm, weight: 785 g, Photos: 50 B&W, 0 Color; Drawings: 50 B&W, 0 Color; Graphs: 20 B&W, 0 Color
  • Išleidimo metai: 19-Apr-2012
  • Leidėjas: Wiley-IEEE Press
  • ISBN-10: 0470623462
  • ISBN-13: 9780470623466
Kitos knygos pagal šią temą:
Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMCDidesnis paveikslėlis
  • Formatas: Hardback, 384 pages, aukštis x plotis x storis: 244x163x31 mm, weight: 785 g, Photos: 50 B&W, 0 Color; Drawings: 50 B&W, 0 Color; Graphs: 20 B&W, 0 Color
  • Išleidimo metai: 19-Apr-2012
  • Leidėjas: Wiley-IEEE Press
  • ISBN-10: 0470623462
  • ISBN-13: 9780470623466
Kitos knygos pagal šią temą:
Pastovi nuoroda: https://www.kriso.lt/db/9780470623466.html
Raktažodžiai:
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems

Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.

Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:





The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems



The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias



Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations



The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards



An equivalent circuit model of through-silicon vias



Metal-oxide-semiconductor capacitance effects of through-silicon vias





Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Foreword xi
Preface xiii
1 Introduction
1(15)
1.1 Introduction of Electronic Package Integration
1(5)
1.2 Review of Modeling Technologies
6(4)
1.3 Organization of the Book
10(6)
References
11(5)
2 Macromodeling of Complex Interconnects in 3D Integration
16(81)
2.1 Introduction
16(3)
2.1.1 Scope of macromodeling
18(1)
2.1.2 Macromodeling in the picture of electrical modeling of interconnects
19(1)
2.2 Network Parameters: Impedance, Admittance, and Scattering Matrices
19(6)
2.2.1 Impedance matrix
21(1)
2.2.2 Admittance matrix
22(1)
2.2.3 Scattering matrix
23(1)
2.2.4 Conversion between Z, Y, and S matrices
24(1)
2.3 Rational Function Approximation with Partial Fractions
25(4)
2.3.1 Introduction
25(2)
2.3.2 Iterative weighted linear least-squares estimator
27(2)
2.4 Vector Fitting (VF) Method
29(12)
2.4.1 Two steps in vector fitting method
29(6)
2.4.2 Fitting vectors with common poles
35(2)
2.4.3 Selection of initial poles
37(1)
2.4.4 Enhancement to the original vector fitting method
38(3)
2.5 Macromodel Synthesis
41(7)
2.5.1 Jordan canonical method for macromodel synthesis
42(4)
2.5.2 Equivalent circuits
46(2)
2.6 Stability, Causality, and Passivity of Macromodel
48(31)
2.6.1 Stability
48(2)
2.6.2 Causality
50(4)
2.6.3 Passivity assessment
54(4)
2.6.4 Passivity enforcement
58(20)
2.6.5 Other issues
78(1)
2.7 Macromodeling Applied to High-Speed Interconnects and Circuits
79(12)
2.7.1 A lumped circuit with nonlinear components
79(4)
2.7.2 Vertically natural capacitors (VNCAPs)
83(4)
2.7.3 Stripline-to-microstrip line transition with vias
87(4)
2.8 Conclusion
91(6)
References
92(5)
3 2.5D Simulation Method for 3D Integrated Systems
97(88)
3.1 Introduction
97(1)
3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems
98(29)
3.2.1 Modal expansion of fields in a parallel-plate waveguide (PPWG)
98(3)
3.2.2 Multiple scattering coefficients among cylindrical PEC and perfect magnetic conductor (PMC) vias
101(8)
3.2.3 Excitation source and network parameter extraction
109(8)
3.2.4 Implementation of effective matrix-vector multiplication (MVM) in linear equations
117(4)
3.2.5 Numerical examples for single-layer power-ground planes
121(6)
3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes
127(6)
3.3.1 Perfect magnetic conductor (PMC) boundary
128(1)
3.3.2 Frequency-dependent cylinder layer (FDCL)
128(3)
3.3.3 Validations of FDCL
131(2)
3.4 Numerical Simulations for Finite Structures
133(9)
3.4.1 Extended scattering matrix method (SMM) algorithm for finite structure simulation
133(6)
3.4.2 Modeling of arbitrarily shaped boundary structures
139(3)
3.5 Modeling of 3D Electronic Package Structure
142(40)
3.5.1 Modal expansions and boundary conditions
143(7)
3.5.2 Mode matching in PPWGs
150(8)
3.5.3 Generalized T-matrix for two-layer problem
158(6)
3.5.4 Formulae summary for two-layer problem
164(5)
3.5.5 Formulae summary for 3D structure problem
169(7)
3.5.6 Numerical simulations for multilayered power-ground planes with multiple vias
176(6)
3.6 Conclusion
182(3)
References
183(2)
4 Hybrid Integral Equation Modeling Methods for 3D Integration
185(56)
4.1 Introduction
185(1)
4.2 2D Integral Equation Equivalent Circuit (IEEC) Method
186(34)
4.2.1 Overview of the algorithm
186(1)
4.2.2 Modal decoupling inside the power distribution network (PDN)
187(2)
4.2.3 2D integral equation solution of parallel plate mode in power-ground planes (PGPs)
189(5)
4.2.4 Combinations of transmission and parallel plate modes
194(11)
4.2.5 Cascade connections of equivalent networks
205(9)
4.2.6 Simulation results
214(6)
4.3 3D Hybrid Integral Equation Method
220(18)
4.3.1 Overview of the algorithm
220(4)
4.3.2 Equivalent electromagnetic currents and dyadic green's functions
224(7)
4.3.3 Simulation results
231(7)
4.4 Conclusion
238(3)
References
238(3)
5 Systematic Microwave Network Analysis for 3D Integrated Systems
241(90)
5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair
242(39)
5.1.1 Introduction
242(3)
5.1.2 Segmentation of vias and a plate pair
245(3)
5.1.3 An intrinsic 3-port via circuit model
248(15)
5.1.4 Determination of the virtual via boundary
263(4)
5.1.5 Complete model for multiple vias in an irregular plate pair
267(2)
5.1.6 Validation and measurements
269(11)
5.1.7 Conclusion
280(1)
5.2 Parallel Plane Pair Model
281(24)
5.2.1 Introduction
281(2)
5.2.2 Overview of two conventional Zpp definitions
283(2)
5.2.3 New Zpp definition using the zero-order parallel plate waves
285(5)
5.2.4 Analytical formula for radial scattering matrix SRpp in a circular plate pair
290(2)
5.2.5 BIE method to evaluate SRpp for an irregular plate pair
292(4)
5.2.6 Numerical examples and measurements
296(7)
5.2.7 Conclusion
303(2)
5.3 Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias
305(26)
5.3.1 Introduction
305(2)
5.3.2 Multilayer PCB with vias and decoupling capacitors
307(1)
5.3.3 Systematic microwave network method
308(8)
5.3.4 Validations and discussion
316(8)
5.3.5 Conclusion
324(2)
Appendix: Properties of the Auxiliary Function Wmn(x, y)
326(1)
References
327(4)
6 Modeling of Through-Silicon Vias (TSV) in 3D Integration
331(30)
6.1 Introduction
331(5)
6.1.1 Overview of process and fabrication of TSV
332(3)
6.1.2 Modeling of TSV
335(1)
6.2 Equivalent Circuit Model for TSV
336(15)
6.2.1 Overview
337(1)
6.2.2 Problem statement: Two-TSV configuration
338(1)
6.2.3 Wideband Pi-type equivalent-circuit model
339(2)
6.2.4 Rigorous closed-form formulae for resistance and inductance
341(4)
6.2.5 Scattering parameters of two-TSV system
345(1)
6.2.6 Results and discussion
346(5)
6.3 MOS Capacitance Effect of TSV
351(5)
6.3.1 MOS capacitance effect
351(1)
6.3.2 Bias voltage-dependent MOS capacitance of TSVs
351(4)
6.3.3 Results and analysis
355(1)
6.4 Conclusion
356(5)
References
358(3)
Index 361
ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.