| Preface |
|
xi | |
| Exordium |
|
xv | |
| Introduction |
|
xix | |
| 1 The EMC Basic Knowledge and the Essence of the EMC Test |
|
1 | (36) |
|
|
|
1 | (1) |
|
1.2 Conduction, Radiation, and Transient |
|
|
2 | (2) |
|
|
|
4 | (17) |
|
1.3.1 Time Domain and Frequency Domain |
|
|
4 | (1) |
|
1.3.2 The Concept of the Unit for Electromagnetic Disturbance, dB |
|
|
5 | (1) |
|
1.3.3 The True Meaning of Decibel |
|
|
6 | (3) |
|
1.3.4 Electric Field, Magnetic Field, and Antennas |
|
|
9 | (8) |
|
1.3.5 Resonance of the RLC Circuit |
|
|
17 | (4) |
|
1.4 Common Mode and Differential Mode in the EMC Domain |
|
|
21 | (2) |
|
1.5 Essence of the EMC Test |
|
|
23 | (14) |
|
1.5.1 Essence of the Radiated Emission Test |
|
|
23 | (2) |
|
1.5.2 Essence of the Conducted Emission Test |
|
|
25 | (4) |
|
1.5.3 Essence of the ESD Immunity Test |
|
|
29 | (1) |
|
1.5.4 Essence of the Radiated Immunity Test |
|
|
30 | (2) |
|
1.5.5 Essence of the Common-Mode Conducted Immunity Test |
|
|
32 | (2) |
|
1.5.6 Essence of the Differential-Mode Conducted Immunity Test |
|
|
34 | (1) |
|
1.5.7 Differential-Mode and Common-Mode Hybrid Conducted Immunity Test |
|
|
35 | (2) |
| 2 Architecture, Shielding, and Grounding Versus EMC of the Product |
|
37 | (64) |
|
|
|
37 | (4) |
|
2.1.1 Architecture Versus EMC of the Product |
|
|
37 | (1) |
|
2.1.2 Shielding Versus EMC of the Product |
|
|
38 | (2) |
|
2.1.3 Grounding Versus EMC of the Product |
|
|
40 | (1) |
|
2.2 Analyses of Related Cases |
|
|
41 | (60) |
|
2.2.1 Case 1: The Conducted Disturbance and the Grounding |
|
|
41 | (5) |
|
2.2.2 Case 2: The Ground Loop During the Conducted Emission Test |
|
|
46 | (3) |
|
2.2.3 Case 3: Where the Radiated Emission Outside the Shield Comes From |
|
|
49 | (3) |
|
2.2.4 Case 4: The "Floating" Metal and the Radiation |
|
|
52 | (3) |
|
2.2.5 Case 5: Radiated Emission Caused by the Bolt Extended Outside the Shield |
|
|
55 | (4) |
|
2.2.6 Case 6: The Compression Amount of the Shield and Its Shielding Effectiveness |
|
|
59 | (3) |
|
2.2.7 Case 7: The EMI Suppression Effectiveness of the Shielding Layer Between the Transformer's Primary Winding and Secondary Winding in the Switching-Mode Power Supply |
|
|
62 | (6) |
|
2.2.8 Case 8: Bad Contact of the Metallic Casing and System Reset |
|
|
68 | (2) |
|
2.2.9 Case 9: ESD Discharge and the Screw |
|
|
70 | (1) |
|
2.2.10 Case 10: Heatsink Also Affects the ESD Immunity |
|
|
71 | (1) |
|
2.2.11 Case 11: How Grounding Benefits EMC Performance |
|
|
72 | (4) |
|
2.2.12 Case 12: The Heatsink Shape Affects Conducted Emissions from the Power Ports |
|
|
76 | (6) |
|
2.2.13 Case 13: The Metallic Casing Oppositely Causes the EMI Test Failed |
|
|
82 | (6) |
|
2.2.14 Case 14: Whether Directly Connecting the PCB Reference Ground to the Metallic Casing Will Lead to ESD |
|
|
88 | (6) |
|
2.2.15 Case 15: How to Interconnect the Digital Ground and the Analog Ground in the Digital-Analog Mixed Devices |
|
|
94 | (7) |
| 3 EMC Issues with Cables, Connectors, and Interface Circuits |
|
101 | (60) |
|
|
|
101 | (6) |
|
3.1.1 Cable Is the Weakest Link in the System |
|
|
101 | (1) |
|
3.1.2 The Interface Circuit Provides Solutions to the Cable Radiation Problem |
|
|
102 | (1) |
|
3.1.3 Connectors Are the Path Between the Interface Circuit and the Cable |
|
|
103 | (1) |
|
3.1.4 The Interconnection between the PCBs Is the Weakest Link of the Product EMC |
|
|
104 | (3) |
|
3.2 Analyses of Related Cases |
|
|
107 | (54) |
|
3.2.1 Case 16: The Excessive Radiation Caused by the Cabling |
|
|
107 | (3) |
|
3.2.2 Case 17: Impact from the Pigtail of the Shielded Cable |
|
|
110 | (3) |
|
3.2.3 Case 18: The Radiated Emission from the Grounding Cable |
|
|
113 | (4) |
|
3.2.4 Case 19: Is the Shielded Cable Clearly Better than the Unshielded Cable? |
|
|
117 | (7) |
|
3.2.5 Case 20: Impacts on ESD Immunity of the Plastic Shell Connectors and the Metallic Shell Connector |
|
|
124 | (2) |
|
3.2.6 Case 21: The Selection of the Plastic Shell Connector and the ESD Immunity |
|
|
126 | (2) |
|
3.2.7 Case 22: When the Shield Layer of the Shielded Cable Is Not Grounded |
|
|
128 | (3) |
|
3.2.8 Case 23: The Radiated Emission Problem Brings Out Two EMC Design Problems of a Digital Camera |
|
|
131 | (7) |
|
3.2.9 Case 24: Why PCB Interconnecting Ribbon Is So Important for EMC |
|
|
138 | (6) |
|
3.2.10 Case 25: Excessive Radiated Emission Caused by the Loop |
|
|
144 | (5) |
|
3.2.11 Case 26: Pay Attention to the Interconnection and Wiring Inside the Product |
|
|
149 | (2) |
|
3.2.12 Case 27: Consequences of the Mixed Wiring Between Signal Cable and Power Cable |
|
|
151 | (4) |
|
3.2.13 Case 28: What Should Be Noticed When Installing the Power Filters |
|
|
155 | (6) |
| 4 Filtering and Suppression for EMC Performance Improvement |
|
161 | (82) |
|
|
|
161 | (12) |
|
4.1.1 Filtering Components |
|
|
161 | (6) |
|
4.1.2 Surge Protection Components |
|
|
167 | (6) |
|
4.2 Analyses of Related Cases |
|
|
173 | (70) |
|
4.2.1 Case 29: The Radiated Emission Caused by a Hub Exceeds the Standard Limit |
|
|
173 | (5) |
|
4.2.2 Case 30: Installation of the Power Supply Filter and the Conducted Emission |
|
|
178 | (4) |
|
4.2.3 Case 31: Filtering the Output Port May Impact the Conducted Disturbance of the Input Port |
|
|
182 | (5) |
|
4.2.4 Case 32: Properly Using the Common-Mode Inductor to Solve the Problem in the Radiated and Conducted Immunity Test |
|
|
187 | (3) |
|
4.2.5 Case 33: The Design of Differential-Mode Filter for Switching-Mode Power Supply |
|
|
190 | (6) |
|
4.2.6 Case 34: Design of the Common-Mode Filter for Switching-Mode Power Supply |
|
|
196 | (7) |
|
4.2.7 Case 35: Whether More Filtering Components Mean Better Filtering Effectiveness |
|
|
203 | (5) |
|
4.2.8 Case 36: The Events Should Be Noticed When Positioning the Filters |
|
|
208 | (3) |
|
4.2.9 Case 37: How to Solve Excessive Harmonic Currents of Switching-Mode Power Supply |
|
|
211 | (2) |
|
4.2.10 Case 38: Protections from Resistors and TVSs on the Interface Circuit |
|
|
213 | (5) |
|
4.2.11 Case 39: Can the Surge Protection Components Be in Parallel Arbitrarily? |
|
|
218 | (6) |
|
4.2.12 Case 40: Components in Surge Protection Design Must Be Coordinated |
|
|
224 | (2) |
|
4.2.13 Case 41: The Lightning Protection Circuit Design and the Component Selections Must Be Careful |
|
|
226 | (1) |
|
4.2.14 Case 42: Strict Rule for Installing the Lightening Protections |
|
|
227 | (3) |
|
4.2.15 Case 43: How to Choose the Clamping Voltage and the Peak Power of TVS |
|
|
230 | (2) |
|
4.2.16 Case 44: Choose the Diode for Clamping or the TVS for Protection |
|
|
232 | (3) |
|
4.2.17 Case 45: Ferrite Ring Core and EFT/B Immunity |
|
|
235 | (3) |
|
4.2.18 Case 46: How Ferrite Bead Reduces the Radiated Emission of Switching-Mode Power Supply |
|
|
238 | (5) |
| 5 Bypassing and Decoupling |
|
243 | (46) |
|
|
|
243 | (10) |
|
5.1.1 The Concept of Decoupling, Bypassing, and Energy Storage |
|
|
243 | (1) |
|
|
|
244 | (4) |
|
|
|
248 | (1) |
|
5.1.4 The Selection of Decoupling Capacitor and Bypass Capacitor |
|
|
249 | (2) |
|
5.1.5 Capacitor Paralleling |
|
|
251 | (2) |
|
5.2 Analyses of Related Cases |
|
|
253 | (36) |
|
5.2.1 Case 47: The Decoupling Effectiveness for the Power Supply and the Capacitance of Capacitor |
|
|
253 | (5) |
|
5.2.2 Case 48: Locations of the Ferrite Bead and Decoupling Capacitor Connected to the Chip's Power Supply Pin |
|
|
258 | (5) |
|
5.2.3 Case 49: Producing Interference of the ESD Discharge |
|
|
263 | (3) |
|
5.2.4 Case 50: Using Small Capacitance Can Help Solve a Longstanding Problem |
|
|
266 | (2) |
|
5.2.5 Case 51: How to Deal with the ESD Air Discharge Point for the Product with Metallic Casing |
|
|
268 | (2) |
|
5.2.6 Case 52: ESD and Bypass Capacitor for Sensitive Signals |
|
|
270 | (3) |
|
5.2.7 Case 53: Problems Caused by the Inappropriate Positioning of the Magnetic Bead During Surge Test |
|
|
273 | (2) |
|
5.2.8 Case 54: The Role of the Bypass Capacitor |
|
|
275 | (3) |
|
5.2.9 Case 55: How to Connect the Digital Ground and the Analog Ground at Both Sides of the Opto-Coupler |
|
|
278 | (4) |
|
5.2.10 Case 56: Diode and Energy Storage, the Immunity of Voltage Dip, and Voltage Interruption |
|
|
282 | (7) |
| 6 PCB Design and EMC |
|
289 | (78) |
|
|
|
289 | (4) |
|
6.1.1 PCB Is a Microcosm of a Complete Product |
|
|
289 | (1) |
|
6.1.2 Loops Are Everywhere in PCB |
|
|
289 | (1) |
|
6.1.3 Crosstalk Must Be Prevented |
|
|
290 | (1) |
|
6.1.4 There Are Many Antennas in the PCB |
|
|
291 | (1) |
|
6.1.5 The Impedance of the Ground Plane in PCB Directly Influences the Transient Immunity |
|
|
291 | (2) |
|
6.2 Analyses of Related Cases |
|
|
293 | (74) |
|
6.2.1 Case 57: The Role of "Quiet" Ground |
|
|
293 | (5) |
|
6.2.2 Case 58: The Loop Formed by PCB Routing Causes Product Reset During ESD Test |
|
|
298 | (5) |
|
6.2.3 Case 59: Unreasonable PCB Wiring Causes the Interface Damaged by Lightning Surge |
|
|
303 | (2) |
|
6.2.4 Case 60: How to Dispose the Grounds at Both Sides of Common-Mode Inductor |
|
|
305 | (4) |
|
6.2.5 Case 61: Avoid Coupling When the Ground Plane and the Power Plane Are Poured on PCB |
|
|
309 | (5) |
|
6.2.6 Case 62: The Relationship Between the Width of PCB Trace and the Magnitude of the Surge Current |
|
|
314 | (3) |
|
6.2.7 Case 63: How to Avoid the Noise of the Oscillator Being Transmitted to the Cable Port |
|
|
317 | (2) |
|
6.2.8 Case 64: The Radiated Emission Caused by the Noise from the Address Lines |
|
|
319 | (5) |
|
6.2.9 Case 65: The Disturbance Produced by the Loop |
|
|
324 | (5) |
|
6.2.10 Case 66: The Spacing Between PCB Layers and EMI |
|
|
329 | (5) |
|
6.2.11 Case 67: Why the Sensitive Trace Routed at the Edge of the PCB Is Susceptible to the ESD Disturbance |
|
|
334 | (4) |
|
6.2.12 Case 68: EMC Test Can Be Passed by Reducing the Series Resistance on the Signal Line |
|
|
338 | (1) |
|
6.2.13 Case 69: Detailed Analysis Case for the PCB Design of Analog-Digital Mixed Circuit |
|
|
339 | (18) |
|
6.2.14 Case 70: Why the Oscillator Cannot Be Placed on the Edge of the PCB |
|
|
357 | (3) |
|
6.2.15 Case 71: Why the Local Ground Plane Needs to Be Placed Under the Strong Radiator |
|
|
360 | (3) |
|
6.2.16 Case 72: The Routing of the Interface Circuit and the ESD Immunity |
|
|
363 | (4) |
| 7 Components, Software, and Frequency Jitter Technique |
|
367 | (14) |
|
7.1 Components, Software, and EMC |
|
|
367 | (1) |
|
7.2 Frequency Jitter Technique and EMC |
|
|
368 | (1) |
|
7.3 Analyses of Related Cases |
|
|
368 | (13) |
|
7.3.1 Case 73: Effect on the System EMC Performance from the EMC Characteristics of the Component and Software Versus Cannot Be Ignored |
|
|
368 | (3) |
|
7.3.2 Case 74: Software and ESD Immunity |
|
|
371 | (2) |
|
7.3.3 Case 75: The Conducted Emission Problem Caused by Frequency Jitter Technique |
|
|
373 | (6) |
|
7.3.4 Case 76: The Problems of Circuit and Software Detected by Voltage Dip and Voltage Interruption Tests |
|
|
379 | (2) |
| Appendix A EMC Terms |
|
381 | (4) |
| Appendix B EMC Tests in Relevant Standard for Residential Product, Industrial, Scientific, and Medical Product, Railway Product, and Others |
|
385 | (20) |
| Appendix C EMC Test for Automotive Electronic and Electrical Components |
|
405 | (24) |
| Appendix D Military Standard Commonly Used for EMC Test |
|
429 | (26) |
| Appendix E EMC Standards and Certification |
|
455 | (12) |
| Further Reading |
|
467 | (2) |
| Index |
|
469 | |
Daugiau apie elektronines knygas