Preface |
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xiii | |
About the Companion Websites |
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xv | |
1 Why Surfaces and Interfaces of Electronic Materials |
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1 | (13) |
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1.1 The Impact of Electronic Materials |
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1 | (1) |
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1.2 Surface and Interface Importance as Electronics Shrink |
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1 | (4) |
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1.3 Historical Background |
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5 | (5) |
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1.3.1 Contact Electrification and the Development of Solid State Concepts |
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5 | (1) |
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1.3.2 Crystal Growth and Refinement |
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5 | (1) |
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1.3.3 Transistor Development and the Birth of Semiconductor Devices |
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6 | (2) |
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1.3.4 Surface Science and Microelectronics |
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8 | (2) |
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1.4 Next Generation Electronics |
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10 | (1) |
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10 | (1) |
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11 | (2) |
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13 | (1) |
2 Semiconductor Electronic and Optical Properties |
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14 | (8) |
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2.1 The Semiconductor Band Gap |
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14 | (1) |
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2.2 The Fermi Level and Energy Band Parameters |
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15 | (2) |
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2.3 Band Bending at Semiconductor Surfaces and Interfaces |
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17 | (1) |
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2.4 Surfaces and Interfaces in Electronic Devices |
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17 | (2) |
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2.5 Effects of Localized States: Traps, Dipoles, and Barriers |
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19 | (1) |
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19 | (1) |
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20 | (1) |
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20 | (1) |
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21 | (1) |
3 Electrical Measurements of Surfaces and Interfaces |
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22 | (20) |
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3.1 Sheet Resistance and Contact Resistivity |
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22 | (1) |
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3.2 Contact Measurements: Schottky Barrier Overview |
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23 | (12) |
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3.2.1 Ideal Schottky Barriers |
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24 | (2) |
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3.2.2 Real Schottky Barriers: Role of Interface States |
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26 | (2) |
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3.2.3 Schottky Barrier Measurements |
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28 | (6) |
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3.2.4 Schottky Barrier Conclusions |
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34 | (1) |
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3.3 Heterojunction Band Offsets: Electrical Measurements |
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35 | (3) |
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38 | (1) |
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38 | (1) |
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39 | (2) |
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41 | (1) |
4 Localized States at Surfaces and Interfaces |
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42 | (13) |
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4.1 Interface State Models |
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42 | (1) |
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4.2 Intrinsic Surface States |
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43 | (6) |
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4.2.1 Experimental Approaches |
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43 | (2) |
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4.2.2 Theoretical Approaches |
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45 | (4) |
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4.2.3 Key Intrinsic Surface State Results |
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49 | (1) |
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4.3 Extrinsic Surface States |
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49 | (3) |
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4.4 The Solid State Interface: Changing Perspectives |
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52 | (1) |
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52 | (1) |
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53 | (1) |
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54 | (1) |
5 Ultrahigh Vacuum Technology |
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55 | (12) |
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5.1 Ultrahigh Vacuum Chambers |
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55 | (2) |
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5.1.1 Ultrahigh Vacuum Pressures |
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55 | (1) |
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5.1.2 Stainless Steel UHV Chambers |
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56 | (1) |
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57 | (4) |
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61 | (1) |
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61 | (1) |
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5.5 Residual Gas Analysis |
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62 | (1) |
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62 | (2) |
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64 | (1) |
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65 | (1) |
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65 | (1) |
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65 | (1) |
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66 | (1) |
6 Surface and Interface Analysis |
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67 | (9) |
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6.1 Surface and Interface Techniques |
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67 | (3) |
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6.2 Excited Electron Spectroscopies |
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70 | (2) |
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6.3 Principles of Surface Sensitivity |
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72 | (1) |
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6.4 Multi-technique UHV Chambers |
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73 | (2) |
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75 | (1) |
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75 | (1) |
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75 | (1) |
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75 | (1) |
7 Surface and Interface Spectroscopies |
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76 | (42) |
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7.1 Photoemission Spectroscopy |
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76 | (13) |
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7.1.1 The Photoelectric Effect |
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76 | (1) |
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7.1.2 Energy Distribution Curves |
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77 | (1) |
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7.1.3 Atomic Orbital Binding Energies |
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78 | (1) |
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7.1.4 Photoionization Cross Sections |
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78 | (3) |
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7.1.5 Principles of X-Ray Photoelectron Spectroscopy |
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81 | (5) |
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7.1.6 Advanced Surface and Interface Techniques |
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86 | (1) |
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7.1.7 Excitation Sources: X-Ray, Ultraviolet, and Synchrotron |
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87 | (1) |
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7.1.8 Electron Energy Analyzers |
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88 | (1) |
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7.1.9 Photoemission Spectroscopy Summary |
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89 | (1) |
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7.2 Auger Electron Spectroscopy |
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89 | (9) |
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7.2.1 Auger versus X-Ray Transition Probabilities |
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92 | (1) |
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7.2.2 Auger Electron Energies |
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93 | (3) |
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7.2.3 Quantitative AES Analysis |
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96 | (2) |
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7.2.4 Auger Electron Spectroscopy Summary |
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98 | (1) |
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7.3 Electron Energy Loss Spectroscopy |
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98 | (6) |
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7.3.1 Dielectric Response Theory |
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100 | (1) |
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7.3.2 Surface Phonon Scattering |
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101 | (1) |
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102 | (1) |
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7.3.4 Interface Electronic Transitions |
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103 | (1) |
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7.3.5 Transmission Electron Microscopy Energy Loss Spectroscopy |
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104 | (1) |
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7.3.6 Electron Energy Loss Spectroscopy Summary |
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104 | (1) |
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7.4 Rutherford Backscattering Spectrometry |
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104 | (8) |
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7.4.1 Theory of Rutherford Backscattering |
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105 | (3) |
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7.4.2 Rutherford Backscattering Equipment |
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108 | (1) |
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7.4.3 RBS Experimental Spectra |
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109 | (1) |
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7.4.4 RBS Interface Studies |
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110 | (1) |
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7.4.5 Channeling and Blocking |
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111 | (1) |
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7.4.6 Rutherford Backscattering Spectroscopy Summary |
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112 | (1) |
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7.5 Surface and Interface Technique Summary |
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112 | (1) |
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113 | (3) |
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116 | (1) |
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117 | (1) |
8 Dynamical Depth-Dependent Analysis and Imaging |
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118 | (13) |
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8.1 Ion Beam-Induced Surface Ablation |
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118 | (1) |
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8.2 Auger Electron Spectroscopy |
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119 | (2) |
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8.3 X-Ray Photoemission Spectroscopy |
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121 | (1) |
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8.4 Secondary Ion Mass Spectrometry |
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122 | (6) |
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122 | (1) |
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123 | (3) |
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8.4.3 Secondary Ion Yields |
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126 | (2) |
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8.4.4 Organic and Biological Species |
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128 | (1) |
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128 | (1) |
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8.5 Spectroscopic Imaging |
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128 | (1) |
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8.6 Depth-Resolved and Imaging Summary |
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129 | (1) |
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129 | (1) |
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130 | (1) |
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130 | (1) |
9 Electron Beam Diffraction and Microscopy of Atomic-Scale Geometrical Structure |
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131 | (21) |
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9.1 Low Energy Electron Diffraction Principles |
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131 | (10) |
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9.1.1 Low-Energy Electron Diffraction Techniques |
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132 | (1) |
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132 | (2) |
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134 | (1) |
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9.1.4 LEED Reconstructions, Surface Lattices, and Superstructures |
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134 | (3) |
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9.1.5 Representative Semiconductor Reconstructions |
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137 | (4) |
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9.2 Reflection High Energy Electron Diffraction |
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141 | (3) |
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9.2.1 Principles of RHEED |
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141 | (1) |
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142 | (1) |
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143 | (1) |
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9.3 Scanning Electron Microscopy |
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144 | (1) |
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9.3.1 Scanning Auger Microscopy |
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144 | (1) |
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9.3.2 Photoelectron Microscopy |
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144 | (1) |
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9.4 Transmission Electron Microscopy |
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145 | (3) |
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9.4.1 Atomic Imaging: Z-Contrast |
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145 | (1) |
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9.4.2 Surface Atomic Geometry |
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146 | (1) |
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9.4.3 Electron Energy Loss Spectroscopy |
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146 | (2) |
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9.5 Electron Beam Diffraction and Microscopy Summary |
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148 | (1) |
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149 | (1) |
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150 | (1) |
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151 | (1) |
10 Scanning Probe Techniques |
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152 | (14) |
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10.1 Atomic Force Microscopy |
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152 | (3) |
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10.1.1 Non-Contact Mode AFM |
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153 | (1) |
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10.1.2 Kelvin Probe Force Microscopy |
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153 | (2) |
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155 | (1) |
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10.2 Scanning Tunneling Microscopy |
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155 | (7) |
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156 | (2) |
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158 | (3) |
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10.2.3 Surface Atomic Structure |
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161 | (1) |
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10.3 Ballistic Electron Energy Microscopy |
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162 | (1) |
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163 | (1) |
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164 | (1) |
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164 | (1) |
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165 | (1) |
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165 | (1) |
11 Optical Spectroscopies |
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166 | (27) |
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166 | (1) |
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166 | (2) |
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11.3 Modulation Techniques |
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168 | (1) |
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11.4 Multiple Surface Interaction Techniques |
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169 | (2) |
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11.5 Spectroscopic Ellipsometry |
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171 | (1) |
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11.6 Surface Enhanced Raman Spectroscopy |
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171 | (3) |
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11.7 Surface Photoconductivity |
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174 | (1) |
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11.8 Surface Photovoltage Spectroscopy |
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175 | (5) |
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11.8.1 Transient Surface Photovoltage Spectroscopy |
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180 | (1) |
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11.9 Photoluminescence Spectroscopy |
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180 | (1) |
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11.10 Cathodoluminescence Spectroscopy |
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181 | (9) |
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181 | (1) |
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182 | (1) |
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11.10.3 Semiconductor Ionization Energies |
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183 | (2) |
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11.10.4 Universal RangeEnergy Relations |
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185 | (2) |
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11.10.5 Monte Carlo Simulations |
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187 | (1) |
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11.10.6 Depth-Resolved Cathodoluminescence Spectroscopy |
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188 | (1) |
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11.10.7 Spatially-Resolved Cathodoluminescence Spectroscopy and Imaging |
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189 | (1) |
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190 | (1) |
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191 | (1) |
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192 | (1) |
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192 | (1) |
12 Electronic Material Surfaces |
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193 | (20) |
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193 | (3) |
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12.1.1 Surface Relaxation and Reconstruction |
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193 | (1) |
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12.1.2 Extended Geometric Structure |
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193 | (3) |
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196 | (7) |
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196 | (1) |
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197 | (2) |
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199 | (1) |
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12.2.4 Epitaxical Overlayers |
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199 | (1) |
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200 | (2) |
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12.2.6 Interface Chemical Reaction |
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202 | (1) |
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12.3 Electronic Structure |
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203 | (6) |
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204 | (1) |
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204 | (2) |
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206 | (3) |
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209 | (1) |
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210 | (1) |
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211 | (1) |
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212 | (1) |
13 Surface Electronic Applications |
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213 | (10) |
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13.1 Charge Transfer and Band Bending |
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213 | (3) |
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213 | (2) |
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215 | (1) |
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216 | (1) |
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13.3 Granular Gas Sensors |
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217 | (1) |
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217 | (1) |
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13.5 Chemical and Biosensors |
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217 | (3) |
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13.5.1 Sensor Sensitivity |
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218 | (1) |
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13.5.2 Sensor Selectivity |
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219 | (1) |
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13.6 Surface Electronic Temperature, Pressure, and Mass Sensors |
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220 | (1) |
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220 | (1) |
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221 | (1) |
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222 | (1) |
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222 | (1) |
14 Semiconductor Heterojunctions |
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223 | (26) |
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14.1 Geometrical Structure |
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223 | (7) |
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223 | (1) |
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224 | (4) |
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14.1.3 Two-Dimensional Electron Gas Heterojunctions |
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228 | (1) |
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14.1.4 Strained Layer Superlattices |
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228 | (2) |
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230 | (2) |
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230 | (1) |
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14.2.2 Chemical Reactions |
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231 | (1) |
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14.2.3 Template Overlayers |
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231 | (1) |
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14.3 Electronic Structure |
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232 | (13) |
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14.3.1 Heterojunction Band Offsets |
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232 | (1) |
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14.3.2 Band Offset Measurements |
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233 | (4) |
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14.3.3 Inorganic Heterojunction Results |
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237 | (1) |
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14.3.4 Organic Heterojunctions |
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238 | (1) |
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14.3.5 Heterojunction Band Offset Theories |
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238 | (2) |
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14.3.6 Interface Effects on Band Offsets |
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240 | (1) |
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14.3.7 Theoretical Methods |
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241 | (3) |
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14.3.8 Band Offset Engineering |
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244 | (1) |
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245 | (1) |
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246 | (1) |
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247 | (1) |
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248 | (1) |
15 MetalSemiconductor Interfaces |
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249 | (27) |
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249 | (1) |
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15.2 MetalSemiconductor Interface Dipoles |
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249 | (2) |
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251 | (7) |
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251 | (1) |
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15.3.2 Metal-Induced Gap States |
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252 | (2) |
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15.3.3 Charge Transfer, Electronegativity, and Defects |
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254 | (1) |
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15.3.4 Imperfections, Impurities, and Native Defects |
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255 | (1) |
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15.3.5 Chemisorption, Interface Reaction, and Interfacial Phases |
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255 | (1) |
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15.3.6 Organic SemiconductorMetal Interfaces |
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256 | (2) |
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15.4 Self-Consistent Electrostatic Calculations |
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258 | (1) |
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15.5 Experimental Schottky Barriers |
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259 | (5) |
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15.5.1 Metals on Si and Ge |
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260 | (1) |
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15.5.2 Metals on III-V Compound Semiconductors |
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260 | (2) |
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15.5.3 Metals on II-VI Compound Semiconductors |
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262 | (1) |
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15.5.4 Other Compound Semiconductors |
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263 | (1) |
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15.5.5 Compound Semiconductor Summary |
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264 | (1) |
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15.6 Interface Barrier Height Engineering |
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264 | (2) |
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15.6.1 Macroscopic Methods |
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264 | (1) |
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265 | (1) |
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15.6.3 Thermally-Induced Phase Formation |
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266 | (1) |
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15.6.4 Interdiffused Ohmic Contacts |
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266 | (1) |
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15.7 Atomic-Scale Control |
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266 | (6) |
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15.7.1 Reactive Metal Interlayers |
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267 | (1) |
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15.7.2 Molecular Buffer Layers |
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268 | (1) |
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15.7.3 Semiconductor Interlayers |
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268 | (1) |
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15.7.4 Wet Chemical Treatments |
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268 | (1) |
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269 | (3) |
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272 | (1) |
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272 | (1) |
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273 | (2) |
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275 | (1) |
16 Next Generation Surfaces and Interfaces |
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276 | (7) |
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276 | (2) |
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16.2 Current Device Challenges |
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278 | (1) |
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279 | (3) |
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16.3.1 High-K Dielectrics |
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279 | (1) |
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280 | (1) |
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16.3.3 Spintronics and Topological Insulators |
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280 | (1) |
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281 | (1) |
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16.3.5 Two-Dimensional Materials |
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281 | (1) |
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16.3.6 Quantum-Scale Interfaces |
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281 | (1) |
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16.4 The Essential Guide Conclusions |
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282 | (1) |
Appendices |
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Appendix A Glossary of Commonly Used Symbols |
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283 | (3) |
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Appendix B Table of Acronyms |
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286 | (4) |
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Appendix C Table of Physical Constants and Conversion Factors |
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290 | (1) |
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Appendix D Semiconductor Properties |
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291 | (2) |
Index |
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293 | |