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Handbook of Moire Measurement [Kietas viršelis]

Edited by
  • Formatas: Hardback, 520 pages, aukštis x plotis: 234x156 mm, weight: 997 g
  • Išleidimo metai: 01-Dec-2003
  • Leidėjas: Institute of Physics Publishing
  • ISBN-10: 0750305223
  • ISBN-13: 9780750305228
  • Formatas: Hardback, 520 pages, aukštis x plotis: 234x156 mm, weight: 997 g
  • Išleidimo metai: 01-Dec-2003
  • Leidėjas: Institute of Physics Publishing
  • ISBN-10: 0750305223
  • ISBN-13: 9780750305228
Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for measuring the behavior of materials and structures. Edited by one of the technique's co-inventors, this book brings together extended case studies from experts in the field. Emphasizing applications to real situations, the book presents a very reada

Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moiré Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis is on the application of the method to real situations, and presents a very readable account of the technique from the point of view of the user. As an introduction to the Moiré technique and its variants, this book will be of interest to readers at all levels, but is particularly suitable for undergraduates and graduate students in physics, materials science, and structural and mechanical engineering.
Introduction
1(2)
C A Walker
A brief history of the moire method
2(1)
References
2(1)
Strain Measurements at the Limit---the Moire Microscope
3(46)
Nonlinear analysis of interferometric moire fringes
5(13)
T W Shield
Example fringe data reduction
12(5)
References
17(1)
Microscopic moire interferometry
18(7)
Bongtae Han
Immersion interferometer
18(1)
Optical configuration
19(1)
Four-beam immersion interferometer
20(1)
Mechanical configuration
21(2)
Fringe shifting and O/DFM method
23(1)
References
24(1)
Localized thermal strains in electronic interconnections by microscopic moire interferometry
25(9)
Bongtae Han
Specimen preparation
25(1)
Thin small outline package
26(1)
Leadless chip carrier
27(2)
Effect of underfill encapsulation on flip chip solder bump
29(4)
Plated through hole
33(1)
References
33(1)
Titanium in elastic tension: micromechanical deformation
34(8)
Bongtae Han
Introduction
34(1)
Specimen and loading fixture
34(1)
Experimental procedure and fringe patterns
35(2)
Anomalous strains along the grain boundaries
37(2)
Discussion
39(1)
References
40(2)
Micromechanical thermal deformation of unidirectional boron/aluminum composite
42(7)
Bongtae Han
Experimental procedure and fringe patterns
43(1)
Analysis and results
44(3)
Discussion
47(1)
References
48(1)
Fracture Mechanics
49(72)
Assessment of the shape of crack-tip plastic zones as a function of applied load
51(5)
C A Walker
Peter M MacKenzie
Introduction
51(1)
Experimental details
52(1)
Measurement of Von Mises yield locus
53(1)
Discussion of results
54(1)
Conclusions
54(1)
References
55(1)
Deformation around fatigue cracks from moire fringe measurement
56(10)
Gianni Nicoletto
Introduction
56(1)
Basic crack-tip models
57(1)
Stationary crack under monotonic loading
57(1)
Stationary crack under cyclic loading
58(1)
Experimental details
59(1)
Fatigue crack-tip deformation
60(1)
Local yielding
60(1)
Non-singular stresses
61(1)
Cyclic plasticity
62(1)
Local mode-mixity
62(1)
Summary
63(1)
Acknowledgment
64(1)
References
64(2)
Applications of moire to cellulosic (paper and wood) and concrete materials
66(8)
R E Rowlands
Introduction
66(1)
Analyses
67(1)
Bolted wood connections
67(2)
Fracture of linerboard
69(1)
Fracture processes in concrete
70(2)
Summary
72(1)
References
73(1)
Mixed-mode stress intensity factors in finite, edge-cracked orthotropic plates
74(15)
C A Walker
Jamasri
Introduction
74(1)
Notation
75(1)
Theoretical analysis
75(1)
Displacement fields around the crack-tip
75(2)
Mixed-mode fracture analysis
77(2)
Experiments
79(1)
Specimen preparation
79(1)
Specimen testing
80(1)
Analysis of the results
81(1)
Moire patterns
81(1)
Calculation of stress intensity factors
82(1)
Discussion and conclusions
82(3)
Acknowledgments
85(1)
Appendix: Theory of the numerical approach for solving the characteristic of the biharmonic equation
85(2)
References
87(2)
A hybrid experimental/computational approach to the assessment of crack growth criteria in composite laminates
89(14)
C A Walker
M Jam
Notation
89(1)
Introduction
89(1)
Crack growth criteria---theoretical background
90(1)
Crack growth criterion in use---the experimental problem
91(1)
Outline assessment method
92(4)
Experimental procedure
96(1)
Finite element modelling
96(2)
Validation of the finite element model
98(1)
Stress intensity factors from the closed form solution (isotropic material assumption)
98(1)
Comparison with experimental data
98(1)
Discussion of the computational results
99(2)
Conclusion
101(1)
References
101(2)
Experimental and computational assessment of the T* fracture parameter during creep relaxation
103(7)
C A Walker
Peter M MacKenzie
Introduction
103(1)
T* integral fracture parameter
104(1)
Integration path
104(1)
Experimental procedure
104(2)
Fringe analysis
106(1)
Results
106(3)
References
109(1)
Moire interferometry and crack closure
110(11)
Peter M MacKenzie
Introduction
110(1)
Crack closure
110(1)
Moire interferometry
110(1)
Example applications
111(1)
Specimens
111(1)
Controlled crack development
111(2)
Grating limitations
113(1)
Crack closure effects revealed in moire interferograms
113(5)
Conclusions
118(1)
References
119(2)
Electronic Packaging
121(56)
Determination of effective coefficients of thermal expansion (CTE) of electronic packaging components
123(11)
Yifan Guo
Introduction
123(1)
Definitions of effective CTE
123(2)
Procedures of CTE determination
125(1)
High-temperature replication of specimen gratings
125(1)
Real-time measurements of the thermal expansion
125(1)
Application I: evaluation of thin small outline packages
125(3)
Application II: plastic ball grid array package
128(2)
Application III: CTE as a function of temperature
130(2)
Conclusions
132(1)
References
132(2)
Determinations of thermal strains in solder joints: an application in electric packaging
134(11)
Yifan Guo
Introduction
134(1)
CBGA packages
135(1)
Moire experiments
136(1)
Thermal deformations in CBGA
136(4)
Thermal strain analysis
140(1)
Conclusions
141(2)
References
143(2)
Thermomechanical behaviour of two-phase solder column connection under highly accelerated thermal cycle
145(8)
Bongtae Han
Specimen geometry
145(1)
Experimental procedure and fringe patterns
145(5)
Analysis and discussions
150(1)
Deformed shape
150(1)
Accumulated permanent deformation
151(1)
References
152(1)
Verification of numerical models used in microelectronics product development
153(7)
Bongtae Han
Ceramic ball grid array package assembly
154(2)
Bleed layer on power laminate
156(2)
Discussion
158(1)
References
159(1)
Analysis of residual stresses in a die-attaching adhesive
160(11)
A S Voloshin
Introduction
160(1)
Experiment
161(3)
Results
164(5)
Conclusions
169(1)
References
169(2)
Characterization of thermomechanical behaviour of a flip-chip plastic ball grid array package assembly
171(6)
Bongtae Han
Flip-chip plastic ball grid assembly
171(1)
Grating replication for complex geometry
172(1)
Bithermal loading
172(2)
Result and implication
174(1)
References
175(2)
Complex Shapes
177(60)
Strain gauge verification by moire
179(6)
Peter G Ifju
The objective
179(2)
The experiment
181(3)
References
184(1)
A high-precision calibration of electrical resistance strain gauges by moire interferometry
185(10)
Robert B Watson
Introduction
185(1)
The challenge
186(1)
The high-sensitivity moire solution
186(1)
Assessment of measurement system accuracy
187(2)
Experimental procedure
189(2)
Results
191(2)
Refinements
193(1)
References
193(2)
Interlaminar deformation along the cylindrical surface of a hole in laminated composites
195(12)
Raymond G Boeman
Introduction
195(1)
Experimental procedures
196(2)
Results---straight boundary free edge
198(1)
Results---cylindrical surface of the hole
199(1)
Tangential strains in hole at 90°
200(1)
Transverse strains in hole at θ = 90°
201(2)
Summary
203(1)
Acknowledgments
204(1)
References
205(2)
Interlaminar deformation along the cylindrical surface of a hole in laminated composite tensile specimens
207(14)
David H Mollenhauer
Introduction
207(1)
Fringe patterns
207(2)
Experimental procedure
209(4)
Results
213(7)
References
220(1)
Thick laminated composites in compression: free-edge effects on a ply-by-ply basis
221(9)
Yifan Guo
Introduction
221(1)
In-plane compression
222(3)
Interlaminar compression
225(3)
Laminate properties
228(1)
Conclusions
228(1)
References
229(1)
Loading effects in composite beam specimens
230(7)
Peter G Ifju
References
234(3)
Elastic--Plastic Hole Expansion
237(18)
Elastic--plastic hole expansion: an experimental and theoretical investigation
239(11)
C A Walker
Jim McKelvie
Jim Hyzer
Introduction
239(1)
Residual stress measurement
239(1)
Moire interferometry
239(1)
Hole-drilling method
240(1)
Dissection method
240(1)
Experimental investigation
241(1)
Expansion of a hole in a quasi-infinite plate
241(3)
Expansion of a hole in a thick cylinder and simple lug geometry
244(5)
Conclusion
249(1)
References
249(1)
Roller expansion of tubes in a tube-plate
250(5)
C A Walker
Jim McKelvie
Introduction
250(1)
Experimental procedure
251(2)
References
253(2)
Hybrid Mechanics
255(14)
Some applications of high sensitivity moire interferometry
257(6)
C Ruiz
Introduction
257(1)
Interferometric study of dovetail joints
257(1)
Application to the study of cracks
258(4)
References
262(1)
Hybridizing moire with analytical and numerical techniques: differentiating moire measured displacements to obtain strains
263(6)
R E Rowlands
Introduction
263(1)
Analyses
264(1)
General comments
264(1)
Splines and regression analysis
264(1)
Finite-element concepts
264(3)
Summary
267(1)
References
267(2)
Residual Stresses
269(28)
Automated moire interferometry for residual stress determination in engineering objects
271(16)
Matgorzata Kujawinska
Leszek Satbut
Introduction
271(1)
Objects of measurements
272(1)
Railway rail
272(2)
Laser beam weldment
274(1)
Experimental set-up and procedure
274(4)
Experimental results and discussion
278(1)
Residual strain determination for railway rails
278(1)
Residual stress determination in laser beam welds
279(5)
Conclusions
284(1)
References
285(2)
Determination of thermal stresses near a bimaterial interface
287(7)
Judy D Wood
Experimental procedure
287(1)
Extracting the coefficients of thermal expansion
288(3)
Separation of thermal strains and stress-induced strains
291(1)
Results
291(2)
References
293(1)
Interior strains by a hybrid 3d photoelasticity/moire interferometry technique
294(3)
C W Smith
Frozen stress photoelasticity
294(1)
The hybrid method
295(1)
References
295(2)
High Temperature Effects and Thermal Strains
297(22)
Moire interferometry using grating photography and optical processing
299(12)
Gary Cloud
Case study: whole-field strain analysis to 1370 °C
299(1)
Problem characteristics
299(1)
Moire interferometry with optical Fourier processing
300(1)
Outline of the technique
301(1)
Gratings
302(2)
Grating photography
304(2)
Optical Fourier processing
306(3)
Data processing
309(1)
Closure
309(1)
References
310(1)
Heat-resistant gratings for moire interferometry
311(8)
Colin Forno
Introduction
311(1)
Basic grating procedure
312(1)
Detailed preparation
313(1)
Polishing-induced stresses
314(1)
Optical system aberrations
315(1)
Annealing studies
315(1)
High-temperature studies
316(1)
References
317(2)
Micromechanics and Contact Problems
319(54)
Grid method for damage analysis of ductile materials
321(21)
Jin Fang
Introduction
321(1)
Gratings and experiments
322(1)
Specimens and zero-thickness gratings
322(1)
Quasi-static loading and impulsive loading
322(3)
Image processing of deformed gratings
325(1)
Determination of strain by cross grid
325(2)
Displacement determination by Fourier transform
327(4)
Some analyses of void damage
331(1)
Interaction between the neighbouring voids
331(6)
Flow localization and ductile failure of ligaments
337(3)
Remarks
340(1)
Acknowledgment
340(1)
References
340(2)
A contact problem
342(19)
Jin Fang
Introduction
342(1)
The in-plane contact of two bodies
343(3)
Contact deformation measured by moire interferometry
346(1)
Moire interferometry for displacement patterns
346(1)
A polarized shearing method for derivative patterns
347(4)
An incoherent technique for gradient patterns
351(3)
The hybrid solution of the contact stresses
354(5)
Remarks
359(1)
References
359(2)
Moire interferometry for measurement of strain near mechanical fasteners in composites
361(12)
Gary Cloud
Case study: Whole-field measurement of strain concentrations in composites
361(1)
Approaches to design
362(1)
Design, construction and alignment of interferometer
363(4)
Specimen gratings
367(1)
Recording fringes
368(1)
Data reduction
368(1)
Closing remarks
368(2)
References
370(3)
Out-Of-Plane Deformation, Flatness and Shape Measurement
373(52)
Shadow moire interferometry applied to composite column buckling
375(4)
Peter G Ifju
Xiaokai Niu
Melih Papila
References
378(1)
Shadow moire interferometry with enhanced sensitivity by optical/digital fringe multiplication
379(8)
Bongtae Han
Optical configuration and fringe shifting
380(1)
Optical/digital fringe multiplication (O/DFM)
381(1)
Applications
381(1)
Warpage of electronic device
381(3)
Pre-buckling behaviour of an aluminium channel
384(2)
References
386(1)
Shadow moire interferometry with a phase-stepping technique applied to thermal warpage measurement of modern electronic packages
387(10)
Yinyan Wang
Introduction
387(1)
Application of phase stepping to shadow moire fringe patterns
388(2)
Phase calculation
390(1)
On-line measurement of thermal warpage of modern electronic packages
391(1)
The experimental system
391(1)
Normalization of the sample position
392(1)
Application examples
392(1)
A PBGA through a heating--cooling cycle
392(2)
Analysis of a BGA and its seating printed wire board
394(1)
Conclusion
395(1)
References
396(1)
On-line system for measuring the flatness of large steel plates using projection moire
397(11)
Jussi Paakkari
Motivation
397(1)
Measurement specifications
398(1)
Design of the flatness measurement system
398(1)
System overview
398(1)
Optomechanical design of the measurement unit
399(4)
Image analysis software
403(1)
Performance
404(1)
Quality of the moire signal
404(1)
Calibration
404(1)
Repeatability and depth resolution of flatness measurement
404(2)
Other performance values
406(1)
Conclusion
406(1)
Acknowledgments
407(1)
References
407(1)
Optical triangular profilometry: unified calibration
408(9)
Anand Asundi
Zhou Wensen
Projection ray tracing
408(2)
Image ray tracing
410(1)
Choice
411(1)
Spot inspection
412(2)
Single-line system
414(1)
Projection grating system
415(1)
References
416(1)
Grating diffraction method
417(8)
Anand Asundi
Bing Zhao
A strain microscope with grating diffraction method
419(2)
Grating diffraction strain sensor
421(2)
References
423(2)
Real Time and Dynamic Moire
425(60)
Real-time video moire topography
427(15)
Joris J J Dirckx
Willem F Decraemer
Introduction
427(1)
Theory of fringe formation
427(1)
Modulation and demodulation
427(2)
Shape and deformation measurement
429(1)
Fringe characteristics and fringe enhancement
429(1)
Apparatus
430(1)
Optical set-up
430(1)
Electronic image processing
431(1)
Measurement results
432(1)
Adjustment and calibration
432(1)
Measuring resolution
433(2)
Application example: measurements on the eardrum
435(4)
Discussion and conclusions
439(2)
References
441(1)
Tensile impact delamination of a cross-ply interface studied by moire photography
442(13)
L G Melin
J C Thesken
S Nilsson
L R Benckert
Introduction
442(1)
Experimental methods
443(1)
Optical set-up
443(2)
Tensile split-Hopkinson bar
445(1)
Specimen design and manufacturing
446(1)
Procedure
447(1)
Fringe analysis
447(1)
Results
447(4)
Discussion and conclusions
451(1)
Acknowledgments
452(1)
References
453(2)
Real-time moire image processing
455(30)
M Bruynooghe
Introduction
455(1)
Experimental set-up for real-time defect detection
456(1)
Moire image data
457(1)
Inverse moire image data
457(1)
Moire data acquisition by the phase shifting technique
458(3)
Fringe skeletonizing
461(1)
Moire image enhancement and subsampling
462(1)
Extraction of bright fringes by image segmentation and constrained contour modelling
463(3)
The skeletonizing of dark fringes and background
466(2)
Extraction of dark fringes by a graph technique
468(1)
Experimental results
468(1)
Defect detection by hit/miss transform
469(1)
Optical and digital methods for real-time processing of moire images by morphological hit/miss transform
470(1)
Experimental results
471(2)
Defect detection by multi-dimensional statistical analysis
473(1)
Multi-dimensional statistical analysis of the results of optical correlation experiments
473(1)
Factorial correspondence analysis
474(1)
Analysis of phase moire images by correspondence analysis
475(1)
Rules and decision areas for supervised defect detection
476(1)
Experimental results
476(6)
Conclusion
482(1)
References
482(3)
A Micro-scale strain measurement: limitations due to restrictions inherent in optical systems and phase-stepping routines
485(14)
James McKelvie
Introduction
485(1)
The fringe structure
486(2)
Phase-shifting
487(1)
Displacement versus strain sensitivity
487(1)
The optical limits
488(6)
Under ideal conditions
488(4)
With non-ideal conditions
492(1)
How then to proceed?
493(1)
The recording and analysis systems
494(4)
Conclusions
498(1)
References
498(1)
Index 499
CA Walker Department of Mechanical Engineering, University of Strathclyde, UK