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El. knyga: Infrared Characterization for Microelectronics [World Scientific e-book]

(Formerly Ntu, S'pore)
  • Formatas: 172 pages
  • Išleidimo metai: 28-Apr-1996
  • Leidėjas: World Scientific Publishing Co Pte Ltd
  • ISBN-13: 9789812817464
  • World Scientific e-book
  • Kaina: 60,06 €*
  • * this price gives unlimited concurrent access for unlimited time
  • Formatas: 172 pages
  • Išleidimo metai: 28-Apr-1996
  • Leidėjas: World Scientific Publishing Co Pte Ltd
  • ISBN-13: 9789812817464
Explains the application of infrared absorption spectroscopy to silicon, gallium arsenide, and various dielectric thin films involved in microelectronics processing. Early chapters discuss principles and instrumentation involved, then examine infrared transmitting properties of silicon substrates. Later chapters detail measurement of oxygen and carbon and other impurities in silicon, measurement of epitaxial layer thickness, and characterization of thin films, glasses, and amorphous silicon and related materials. A final chapter looks at applications to microelectronics. Lau is affiliated with Chartered Semiconductor Manufacturing Ltd., Singapore. Annotation c. Book News, Inc., Portland, OR (booknews.com)
Preface v
Introduction to Infrared Spectroscopy
1(14)
Vibrational spectroscopy
1(1)
Infrared spectroscopy and Raman spectroscopy
2(1)
Limitations of selection rules
3(1)
Overtones and combinations
3(1)
Conventional instrumentation for infrared spectroscopy
4(1)
Fourier Transform Infrared (FTIR) Spectrometer
4(1)
Advantages of FTIR over conventional DIR
5(1)
Definitions of common terms in infrared spectroscopy
6(1)
Elementary methods of quantitative analysis for infrared spectroscopy
7(1)
Reflectance infrared measurement
7(2)
Attenuated total reflection (ATR) infrared measurement
9(2)
Reflection absorption infrared measurement
11(4)
References
13(2)
The Properties of Infrared Transparent Substrates
15(10)
The significance of substrates in infrared spectroscopy
15(1)
Different types of infrared transparent substrates
15(1)
Factors that affect the infrared transparency of silicon
16(6)
Recommendations to reduce substrate effects
22(3)
References
23(2)
The Measurement of Oxygen and Carbon and Other Impurities in Silicon
25(20)
Introduction
25(1)
Oxygen in silicon wafers
25(1)
Carbon in silicon wafers
26(1)
The measurement of interstitial oxygen in silicon
27(1)
The measurement of substitutional carbon in silicon
28(1)
The determination of the absorption coefficient α for oxygen and carbon in silicon
28(2)
Limitations of the infrared method
30(1)
The infrared characterization of oxygen precipitates and thermal donors
31(1)
Carbon-oxygen complexes in silicon
32(3)
Nitrogen in silicon
35(1)
Shallow impurities in silicon
36(1)
Hydrogen in silicon
36(2)
The application of infrared spectroscopy to polysilicon
38(3)
Carbon and oxygen in gallium arsenide
41(1)
Summary
41(4)
References
41(4)
The Measurement of Epitaxial Layer Thickness
45(10)
Introduction
45(2)
Optical interference in epitaxial layers
47(1)
Algorithm to measure the thickness of silicon epitaxial layers for a dispersive infrared spectrometer
47(1)
Measurement of epitaxial layer thickness by a reflectance FTIR spectrometer
48(2)
Emission FTIR for insitu measurement of epilayer thicker during the epitaxy process
50(5)
References
53(2)
The Characterization of Silicon Dioxide and Silicon Nitride Thin Films
55(32)
Introduction
55(1)
The application of infrared spectroscopy to silicon dioxide films
56(16)
Silicon dioxide films grown by thermal oxidation
56(5)
Nitrided silicon dioxide films
61(2)
PECVD silicon dioxide films
63(2)
Silicon dioxide films deposited by the O3/TEOS CVD technique
65(1)
Fluorine-doped silicon dioxide films
66(6)
The application of infrared spectroscopy to silicon nitride films
72(8)
Hydrogen in PECVD silicon nitride
72(4)
The application of infrared spectroscopy to silicon-rich and nitrogen-rich PECVD silicon nitride
76(1)
The application of infrared spectroscopy to ECR PECVD silicon nitride films
77(1)
CVD silicon nitride
78(2)
The application of infrared spectroscopy to silicon oxynitride films
80(1)
Summary
80(7)
References
82(5)
The Characterization of PSG, BPSG, SOG and Other Glasses
87(18)
Introduction
87(1)
Phosphorus content in PSG
88(2)
Boron content and phosphorus content in BPSG
90(4)
Stabilization of PSG and BPSG by annealing
94(1)
The detection of moisture penetration through silicon oxynitride passivation by infrared spectroscopy on PSG below passivation
94(3)
The application of infrared spectroscopy to spin-on-glass (SOG)
97(4)
The application of infrared spectroscopy to other glasses used in microelectronics
101(1)
Summary
102(3)
References
102(3)
The Characterization of Amorphous Silicon and Related Materials
105(20)
Introduction
105(1)
Hydrogen content and bonding in hydrogenated amorphous silicon
106(3)
The application of infrared spectroscopy to hydrogenated amorphous silicon-germanium
109(3)
The application of infrared spectroscopy to hydrogenated amorphous silicon-carbide
112(3)
The application of infrared spectroscopy to diamond like carbon films
115(3)
Diamond films
118(1)
Boron nitride films
118(2)
Porous silicon films
120(1)
Microcrystalline silicon and related materials
121(4)
References
122(3)
Miscellaneous Applications of Infrared Spectroscopy to Microelectronics
125(30)
Introduction
125(1)
The application of infrared spectroscopy to polyimides
125(2)
The application of infrared spectroscopy to silicon-on-insulator (SOI) and bonded silicon wafers
127(3)
SIMOX
128(1)
The bonding of Si wafers
129(1)
The application of infrared spectroscopy to study the surface physics of silicon
130(3)
The application of infrared spectroscopy to study the cleaning of silicon
133(1)
The measurement of carbon, oxygen and other impurities in gallium arsenide
133(5)
The measurement of EL2 in semi-insulating gallium arsenide
138(3)
Hydrogen passivation in III-V semiconductors
141(2)
Hydrogen passivation in II-VI semiconductors
143(2)
Detection of crystalline defects by infrared light scattering tomography
145(4)
The application of infrared spectroscopy to microelectronics processing
149(1)
Conclusion of the book
150(5)
References
150(5)
Appendix A 155(4)
Index 159