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El. knyga: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

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  • Formatas: PDF+DRM
  • Išleidimo metai: 26-May-2007
  • Leidėjas: Springer-Verlag New York Inc.
  • Kalba: eng
  • ISBN-13: 9780387329895
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  • Formatas: PDF+DRM
  • Išleidimo metai: 26-May-2007
  • Leidėjas: Springer-Verlag New York Inc.
  • Kalba: eng
  • ISBN-13: 9780387329895
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices.   Furthermore,  practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices.  The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.

This handbook provides the comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product. A handy and reliable reference and manual for self-education, the book is designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions.

Recenzijos

From the reviews:









"The book contains 25 chapters written by experts, mainly drawn from the United States and Europe. The chapters contain good technical details and thorough reference lists, and most of the figures are high quality. For those engaged in developing MOEMS products and similar activities, the acquisition of this book will be a sound investment." (K. Alan Shore, Optics and Photonics News, November, 2007)

List of Contributors
xxvii
Preface xxxi
Materials Physics
Polymer Materials Characterization, Modeling and Application
3(62)
L.J. Ernst
K.M.B. Jansen
D.G. Yang
C. van `t Hof
H.J.L. Bressers
J.H.J. Janssen
G.Q. Zhang
Introduction
3(1)
Polymers in Microelectronics
4(2)
Basics of Visco-Elastic Modeling
6(12)
Preliminary: State Dependent Viscoelasticity
6(4)
Incremental Relationship
10(3)
Linear State Dependent Viscoelasticity
13(1)
Isotropic Material Behavior
14(1)
Interrelations between Property Functions
15(2)
Elastic Approximations
17(1)
Linear Visco-Elastic Modeling (Fully Cured Polymers)
18(16)
Introduction
18(1)
Static Testing of Relaxation Moduli
18(5)
Time-Temperature Superposition Principle
23(1)
Static Testing of Creep Compliances
24(3)
Dynamic Testing
27(7)
Modeling of Curing Polymers
34(19)
``Partly State Dependent'' Modeling (Curing Polymers)
35(14)
``Fully State Dependent'' Modeling (Curing Polymers)
49(4)
Parameterized Polymer Modeling (PPM)
53(12)
PPM Hypotheses
54(1)
Experimental Characterizations
55(7)
PPM Modeling in Virtual Prototyping
62(1)
Acknowledgments
62(1)
References
62(3)
Thermo-Optic Effects in Polymer Bragg Gratings
65(46)
Avram Bar-Cohen
Bongtae Han
Kyoung Joon Kim
Introduction
65(2)
Fundamentals of Bragg Gratings
67(3)
Physical Descriptions
67(1)
Basic Optical Principles
68(2)
Thermo-Optical Modeling of Polymer Fiber Bragg Grating
70(14)
Heat Generation by Intrinsic Absorption
70(8)
Analytical Thermal Model of PFBG
78(2)
FEA Thermal Model of PFBG
80(1)
Thermo-Optical Model of PFBG
80(4)
Thermo-Optical Behavior of PMMA-Based PFBG
84(18)
Description of a PMMA-Based PFBG and Light Sources
85(1)
Power Variation Along the PFBG
86(1)
Thermo-Optical Behavior of the PFBG-LED Illumination
87(5)
Thermo-Optical Behavior of the PFBG-SM LD Illumination
92(9)
Thermo-Optical Behavior of the PFBG Associated with Other Light Sources
101(1)
Concluding Remarks
102(9)
References
102(2)
Appendix 2.A: Solution Procedure to Obtain the Optical Power Along the PFBG
104(2)
Appendix 2.B: Solution Procedure to Determine the Temperature Profile Along the PFBG
106(1)
Solution Procedure of the Temperature Profile Along the PFBG with the LED
106(1)
Solution Procedure of the Temperature Profile Along the PFBG with the SM LD
106(5)
Photorefractive Materials and Devices for Passive Components in WDM Systems
111(24)
Claire Gu
Yisi Liu
Yuan Xu
J.J. Pan
Fengqing Zhou
Liang Dong
Henry He
Introduction
111(3)
Tunable Flat-Topped Filter
114(3)
Principle of Operation
114(2)
Device Simulation
116(1)
Design for Implementation
117(1)
Wavelength Selective 2x2 Switch
117(9)
Principle of Operation
118(1)
Experimental Demonstration
119(2)
Theoretical Analysis
121(2)
Optimized Switch Design
123(2)
Discussion
125(1)
High Performance Dispersion Compensators
126(7)
Multi-Channel Dispersion-Slope Compensator
126(3)
High Precision FBG Fabrication Method and Dispersion Management Filters
129(4)
Conclusions
133(2)
References
133(2)
Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability
135(46)
David T. Read
Alex A. Volinsky
Terminology and Scope
135(2)
Thin Films
135(1)
Motivation
136(1)
Chapter Outline
136(1)
Thin Film Structures and Materials
137(6)
Substrates
137(1)
Epitaxial Films
137(3)
Dielectric Films
140(1)
Metal Films
141(1)
Organic and Polymer Films
142(1)
MEMS Structures
142(1)
Intermediate Layers: Adhesion, Barrier, Buffer, and Seed Layers
142(1)
Manufacturability/Reliability Challenges
143(14)
Film Deposition and Stress
144(3)
Grain Structure and Texture
147(4)
Impurities
151(1)
Dislocations
152(1)
Electromigration and Voiding
153(2)
Structural Considerations
155(1)
Need for Mechanical Characterization
155(1)
Properties of Interest
156(1)
Methods for mechanical characterization of thin films
157(15)
Microtensile Testing
157(2)
Instrumented Indentation
159(5)
Other Techniques
164(1)
Adhesion Tests
165(7)
Materials and Properties
172(1)
Grain Size and Structure Size Effects
172(1)
Properties of Specific Materials
173(2)
Future Research
175(6)
Techniques
175(1)
Properties
175(1)
Length Scale
175(1)
References
176(5)
Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges
181(24)
Alan M. Cassell
Jun Li
Introduction: Physical Characteristics of Carbon Nanotubes
181(5)
Structural
181(1)
Electrical
182(3)
Mechanical
185(1)
Thermal
186(1)
CNT Fabrication Technologies
186(5)
Chemical Vapor Deposition of Carbon Nanotubes
187(2)
Process Integration and Development
189(2)
Carbon Nanotubes as Interconnects
191(3)
Limitations of the Current Technology
191(1)
Architecture, Geometry and Performance Potential Using Carbon Nanotubes
191(3)
Design, Manufacture and Reliability
194(6)
Microstructural Attributes and Effects on Electrical Characteristics
194(2)
Interfacial Contact Materials
196(2)
End-contacted Metal-CNT Junction
198(1)
Thermal Stress Characteristics
198(1)
Reliability Test
199(1)
Summary
200(5)
References
200(5)
Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems
205(64)
A. Wymystowski
G.Q. Zhang
W.D. van Driel
L.J. Ernst
Introduction
205(1)
Physical Aspects for Numerical Simulations
206(19)
Numerical Modeling
208(3)
Material Properties and Models
211(4)
Thermo-Mechanical Related Failures
215(4)
Designing for Reliability
219(6)
Mathematical Aspects of Optimization
225(27)
Design of Experiments
226(10)
Response Surface Modeling
236(6)
Advanced Approach to Virtual Prototyping
242(7)
Designing for Quality
249(3)
Application Case
252(7)
Problem Description
252(1)
Numerical Approach to QFN Package Design
253(6)
Conclusion and Challenges
259(5)
List of Acronyms
264(5)
Acknowledgments
264(1)
References
264(5)
Materials Mechanics
Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension
269(14)
E. Suhir
Introduction
269(1)
Fiber Optics Structural Mechanics
270(3)
Review
270(3)
New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Applications
273(4)
New Nano-Particle Material (NPM)
273(1)
NPM-Based Optical Silica Fibers
274(3)
Conclusions
277(6)
Acknowledgment
277(1)
References
277(6)
Area Array Technology for High Reliability Applications
283(30)
Reza Ghaffarian
Introduction
283(1)
Area Array Packages (AAPs)
284(2)
Advantages of Area Array Packages
285(1)
Disadvantages of Area Arrays
285(1)
Area Array Types
286(1)
Chip Scale Packages (CSPs)
286(2)
Plastic Packages
288(5)
Background
288(1)
Plastic Area Array Packages
288(1)
Plastic Package Assembly Reliability
289(2)
Reliability Data for BGA, Flip Chip BGA, and CSP
291(2)
Ceramic Packages
293(16)
Background
293(1)
Ceramic Package Assembly Reliability
294(1)
Literature Survey on CBGA/CCGA Assembly Reliability
295(2)
CBGA Thermal Cycle Test
297(5)
Comparison of 560 I/O PBGA and CCGA assembly reliability
302(3)
Designed Experiment for Assembly
305(4)
Summary
309(1)
List of Acronyms and Symbols
310(3)
Acknowledgments
311(1)
References
311(2)
Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections
313(38)
Toni T. Mattila
Tomi T. Laurila
Jorma K. Kivilahti
Introduction
313(2)
Approaches and Methods
315(9)
The Four Steps of The Iterative Approach
315(6)
The Role of Different Simulation Tools in Reliability Engineering
321(3)
Interconnection Microstructures and Their Evolution
324(11)
Solidification
324(1)
Solidification Structure and the Effect of Contact Metalization Dissolution
325(5)
Interfacial Reactions Products
330(3)
Deformation Structures (Due to Slip and Twinning)
333(2)
Recovery, Recrystallization and Grain Growth
335(1)
Two Case Studies on Reliability Testing
335(12)
Case 1: Reliability of Lead-Free CSPs in Thermal cycling
337(4)
Case 2: Reliability of Lead-Free CSPs in Drop Testing
341(6)
Summary
347(4)
Acknowledgments
348(1)
References
348(3)
Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections
351(60)
Jin Liang
Nader Dariavach
Dongkai Shangguan
Introduction
351(1)
Physical Metallurgy of Lead-Free Solder Alloys
352(25)
Tin-Lead Solders
352(1)
Lead-Free Solder Alloys
353(4)
Interfacial Reaction: Wetting and Spreading
357(6)
Interfacial Intermetallic Formation and Growth at Liquid-Solid Interfaces
363(14)
Lead-Free Soldering Processes and Compatibility
377(11)
Lead-Free Soldering Materials
378(2)
PCB Substrates and Metalization Finishes
380(1)
Lead-Free Soldering Processes
381(3)
Components for Lead-Free Soldering
384(3)
Design, Equipment and Cost Considerations
387(1)
Reliability of Pb-Free Solder Interconnects
388(18)
Reliability and Failure Distribution of Pb-Free Solder Joints
388(1)
Effects of Loading and Thermal Conditions on Reliability of Solder Interconnection
389(6)
Reliability of Pb-Free Solder Joints in Comparison to Sn-Pb Eutectic Solder Joints
395(11)
Guidelines for Pb-free Soldering and Improvement in Reliability
406(5)
References
406(5)
Fatigue Life Assessment for Lead-Free Solder Joints
411(18)
Masaki Shiratori
Qiang Yu
Introduction
411(1)
The Intermetallic Compound Formed at the Interface of the Solder Joints and the Cu-pad
412(1)
Mechanical Fatigue Testing Equipment and Load Condition in the Lead Free Solder
413(1)
Results of Mechanical Fatigue Test
414(3)
Critical Fatigue Stress Limit for the Intermetallic Compound Layer
417(7)
Influence of the Plating Material on the Fatigue Life of Sn-Zn (Sn-9Zn and Sn-8Zn-3Bi) Solder Joints
424(2)
Conclusion
426(3)
References
426(3)
Lead-Free Solder Materials: Design For Reliability
429(30)
John H.L. Pang
Introduction
429(1)
Mechanics of Solder Materials
430(3)
Fatigue Behavior of Solder Materials
431(2)
Design For Reliability (DFR)
433(2)
Constitutive Models For Lead Free Solders
435(8)
Tensile Test Results
435(5)
Creep Test Results
440(3)
Low Cycle Fatigue Models
443(5)
FEA Modeling and Simulation
448(6)
Reliability Test and Analysis
454(2)
Conclusions
456(3)
Acknowledgments
456(1)
References
456(3)
Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures
459(16)
Arkady Voloshin
Introduction
459(1)
Optical Method and Recording of Fringe Patterns
460(3)
Fractional Fringe Approach
461(1)
Grating Frequency Increase
461(1)
Creation of a High-Frequency Master Grating
462(1)
Combination of the High Grating Frequency and Fractional Fringe Approach
463(1)
Data Processing
463(1)
Test Boards and Specimen Grating
463(2)
Elevated Temperature Test
465(3)
Low Temperature Test
468(2)
Conclusions
470(5)
Acknowledgment
472(1)
References
473(2)
Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods
475(48)
Bongtae Han
Introduction
475(1)
Stress/Strain analysis
476(29)
Moire Interferometry
476(1)
Extension: Microscopic Moire Interferometry
477(2)
Specimen Gratings
479(1)
Strain Analysis
480(1)
Thermal Deformation Measured at Room Temperature
481(4)
Deformation as a Function of Temperature
485(9)
Hygroscopic Deformation
494(7)
Micromechanics
501(4)
Warpage Analysis
505(18)
Twyman/Green Interferometry
505(4)
Shadow Moire
509(5)
Far Infrared Fizeau Interferometry
514(6)
Acknowledgment
520(1)
References
520(3)
Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach
523(32)
Andrew A.O. Tay
Introduction
523(2)
Heat Transfer and Moisture Diffusion in IC Packages
525(2)
Fundamentals of Interfacial Fracture Mechanics
527(2)
Criterion for Crack Propagation
529(1)
Interface Fracture Toughness
529(1)
Total Stress Intensity Factor
530(1)
Calculation of SERR and Mode Mixity
531(7)
Crack Surface Displacement Extrapolation Method
531(1)
Modified J-integral Method
532(1)
Modified Virtual Crack Closure Method
533(3)
Variable Order Boundary Element Method
536(1)
Interaction Integral Method
536(2)
Experimental Verification
538(4)
Case Studies
542(7)
Delamination Along Pad-Encapsulant Interface
542(2)
Delamination Along Die-Attach/Pad Interface
544(2)
Analysis Using Variable Order Boundary Element Method
546(3)
Discussion of the Various Numerical Methods for Calculating G and ψ
549(2)
Conclusion
551(4)
References
551(4)
Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension
555(16)
E. Suhir
Introduction
555(1)
Review
556(1)
Extension: Quality of Shock Protection with a Flexible Wire Elements
557(1)
Analysis
558(9)
Pre-Buckling Mode: Small Displacements
558(6)
Post-Buckling Mode: Large Displacements
564(3)
Conclusions
567(4)
References
568(3)
Dynamic Physical Reliability in Application to Photonic Materials
571(56)
Dov Ingman
Tatiana Mirer
Ephraim Suhir
Introduction: Dynamic Reliability Approach to the Evolution of Silica Fiber Performance
571(14)
Dynamic Physical Model of Damage Accumulation
572(3)
Impact of the Three-Dimensional Mechanical-Temperature-Humidity Load on the Optical Fiber Reliability
575(1)
Effect of Bimodality and Its Explanation Based on the Suggested Model
576(9)
Reliability Improvement through NPM-Based Fiber Structures
585(8)
Environmental Protection by NPM-Based Coating and Overall Self-Curing Effect of NPM Layers
585(2)
Improvement in the Reliability Characteristics by Employing NPM Structures in Optical Fibers
587(6)
Conclusions
593(2)
References
593(2)
High-Speed Tensile Testing of Optical Fibers---New Understanding for Reliability Prediction
595
Sergey Semjonov
G. Scott Glaesemann
Introduction
595(1)
Theory
596(6)
Single-Region Power-Law Model
596(2)
Two-Region Power-Law Model
598(1)
Universal Static and Dynamic Fatigue Curves
599(3)
Experimental
602(4)
Sample Preparation
602(2)
Dynamic Fatigue Tests
604(1)
Static Fatigue Tests
605(1)
Results and Discussion
606(7)
High-Speed Testing
606(4)
Static Fatigue
610(3)
Influence of Multiregion Model on Lifetime Prediction
613(1)
Conclusion
613(14)
References
614(2)
Appendix 18.A: High Speed Axial Strength Testing: Measurement Limits
616(4)
Appendix 18.B: Incorporating Static Fatigue Results into Dynamic Fatigue Curves
620(1)
Static Fatigue Test
620(1)
Dynamic Fatigue Test
621(1)
Discussion
622(5)
The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior
627(40)
Xiaoling He
Introduction
627(3)
Theoretical Development
630(3)
Background on Nonlinear Dynamics and Nonlinear Thermo-Elasticity Theories
630(1)
Nonlinear Thermo-Elasticity Development for an Isotropic Laminate Subject to Thermal and Mechanical and Load
631(2)
Thin Laminate Deflection Response Subject to Thermal Effect and Mechanical Load
633(20)
Steady State Temperature Effect
633(5)
Transient Thermal Field Effect
638(15)
Stress Field in Nonlinear Dynamics Response
653(7)
Stress Field Formulation
653(1)
Stress Distribution
654(1)
Failure Analysis
654(6)
Discussions
660(1)
Summary
661(6)
Nomenclature
662(1)
Acknowledgment
663(1)
References
663(4)
Effect of Material's Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems
667(34)
Victor Birman
Ephraim Suhir
Introduction
667(1)
Effect of Physical Nonlinearity on Vibrations of Piezoelectric Rods Driven by Alternating Electric Field
668(15)
Physically Nonlinear Constitutive Relationships for an Orthotropic Cylindrical Piezoelectric Rod Subject to an Electric Field in the Axial Direction
670(3)
Analysis of Uncoupled Axial Vibrations
673(4)
Solution for Coupled Axial-Radial Axisymmetric Vibrations by the Generalized Galerkin Procedure
677(1)
Numerical Results and Discussion
678(5)
The Effect of the Nonlinear Stress--Strain Relationship on the Response of Optical Fibers
683(12)
Stability of Optical Fibers
684(2)
Stresses and Strains in a Lightwave Coupler Subjected to Tension
686(4)
Free Vibrations
690(2)
Bending of an Optical Fiber
692(3)
Conclusions
695(6)
Acknowledgment
696(1)
References
697(4)
Index 701(10)
List of Contributors
xxvii
Preface xxxi
Physical Design
Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results
3(20)
E. Suhir
Thermal Loading and Thermal Stress Failures
3(1)
Thermal Stress Modeling
4(1)
Bi-Metal Thermostats and other Bi-Material Assemblies
5(1)
Finite-Element Analysis
5(1)
Die-Substrate and other Bi-Material Assemblies
6(2)
Solder Joints
8(1)
Design Recommendations
9(1)
``Global'' and ``Local'' Mismatch and Assemblies Bonded at the Ends
10(1)
Assemblies with Low Modulus Adhesive Layer at the Ends
11(1)
thermally Matched Assemblies
11(1)
Thin Films
12(1)
Polymeric Materials And Plastic Packages
13(1)
Thermal Stress Induced Bowing and Bow-Free Assemblies
14(1)
Probabilistic Approach
15(1)
Optical Fibers and other Photonic Structures
15(1)
Conclusion
16(7)
References
17(6)
Probabilistic Physical Design of Fiber-Optic Structures
23(48)
Satish Radhakrishnan
Ganesh Subbarayan
Luu Nguyen
Introduction
23(2)
Demonstration Vehicle
24(1)
Optical Model
25(5)
Mode Field Diameter
26(1)
Refraction and Reflection Losses
27(1)
Calculations for Coupling Losses
27(1)
Coupling Efficiency
28(2)
Interactions in System and Identification of Critical Variables
30(7)
Function Variable Incidence Matrix
30(1)
Function Variable Incidence Matrix to Graph Conversion
31(3)
Graph Partitioning Techniques
34(1)
System Decomposition using Simulated Annealing
34(3)
Deterministic Design Procedures
37(7)
Optimal and Robust Design
40(2)
A Brief Review of Multi-Objective Optimization
42(1)
Implementation
43(1)
Results
43(1)
Stochastic Analysis
44(2)
The First and Second Order Second Moment Methods
44(2)
Probabilistic Design for Maximum Reliability
46(5)
Results
49(2)
Stochastic Characterization of Epoxy Behavior
51(6)
Viscoelastic Models
52(1)
Modeling the Creep Test
53(1)
Dynamic Mechanical Analysis
54(1)
Experimental Results
55(2)
Analytical Model to Determine VCSEL Displacement
57(10)
Results
63(4)
Summary
67(4)
References
67(4)
The Wirebonded Interconnect: A Mainstay for Electronics
71(50)
Harry K. Charles, Jr.
Introduction
71(10)
Integrated Circuit Revolution
71(1)
Interconnection Types
72(8)
Wirebond Importance
80(1)
Wirebonding Basics
81(14)
Thermocompression Bonding
81(2)
Ultrasonic Bonding
83(2)
Thermosonic Bonding
85(2)
Wirebond Reliability
87(2)
Wirebond Testing
89(4)
Bonding Automation and Optimization
93(2)
Materials
95(10)
Bonding Wire
95(5)
Bond Pad Metallurgy
100(2)
Gold Plating
102(2)
Pad Cleaning
104(1)
Advanced Bonding Methods
105(11)
Fine Pitch Bonding
105(3)
Soft Substrates
108(2)
Machine Improvements
110(1)
Higher Frequency Wirebonding
110(5)
Stud Bumping
115(1)
Summary
116(5)
Acknowledgments
116(1)
References
116(5)
Metallurgical Interconnections for Extreme High and Low Temperature Environments
121(14)
George G. Harman
Introduction
121(1)
High Temperature Interconnections Requirements
122(7)
Wire Bonding
122(5)
The Use of Flip Chips in HTE
127(2)
General Overview of Metallurgical Interfaces for Both HTE and LTE
129(1)
Low Temperature Environment Interconnection Requirements
129(1)
Corrosion and Other Problems in Both HTE, and LTE
130(1)
The Potential Use of High Temperature Polymers in HTE
131(1)
Conclusions
132(3)
Acknowledgments
132(1)
References
132(3)
Design, Process, and Reliability of Wafer Level Packaging
135(16)
Zhuqing Zhang
C.P. Wong
Introduction
135(2)
WLCSP
137(4)
Thin Film Redistribution
137(2)
Encapsulated Package
139(1)
Compliant Interconnect
139(2)
Wafer Level Underfill
141(4)
Challenges of Wafer Level Underfill
142(1)
Examples of Wafer Level Underfill Process
143(2)
Comparison of Flip-Chip and WLCSP
145(1)
Wafer Level Test and Burn-In
145(4)
Summary
149(2)
References
149(2)
Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
151(26)
S.W. Ricky Lee
C.C. Lo
Introduction
151(1)
Design and Fabrication of Silicon Optical Bench with V-grooves
152(6)
Issues of Conventional Passive Alignment Methods
158(4)
V-grooves with Cover Plate
158(3)
Edge Dispensing of Epoxy
161(1)
Modified Passive Alignment Method
162(6)
Working Principle
162(1)
Alignment Mechanism
163(1)
Design of Experiment
164(1)
Experimental Procedures
164(1)
Experimental Results
165(3)
Effects of Epoxy Viscosity and Dispensing Volume
168(2)
Application to Fiber Array Passive Alignment
170(2)
Conclusions and Discussion
172(5)
References
172(5)
Reliability and Packaging
Fundamentals of Reliability and Stress Testing
177(26)
H. Anthony Chan
More Performance at Lower Cost in Shorter Time-to-market
178(2)
Rapid Technological Developments
178(1)
Integration of More Products into Human Life
178(1)
Diverse Environmental Stresses
178(1)
Competitive Market
179(1)
Short Product Cycles
179(1)
The Bottom Line
179(1)
Measure of Reliability
180(4)
Failure Rate
180(1)
Systems with Multiple Independent Failure Modes
181(1)
Failure Rate Distribution
182(2)
Failure Mechanisms in Electronics and Packaging
184(2)
Failure Mechanisms at Chip Level Include
184(1)
Failure Mechanisms at Bonding Include
184(1)
Failure Mechanisms in Device Packages Include
185(1)
Failure Mechanisms in Epoxy Compounds Include
185(1)
Failure Mechanisms at Shelf Level Include
185(1)
Failure Mechanisms in Material Handling Include
185(1)
Failure Mechanisms in Fiber Optics Include
185(1)
Failure Mechanisms in Flat Panel Displays Include
186(1)
Reliability Programs and Strategies
186(1)
Product Weaknesses and Stress Testing
187(4)
Why do Products Fail?
187(2)
Stress Testing Principle
189(2)
Stress Testing Formulation
191(10)
Threshold and Cumulative Stress Failures
191(1)
Stress Stimuli and Flaws
192(1)
Modes of Stress Testing
193(1)
Lifetime Failure Fraction
194(1)
Robustness Against Maximum Service Life Stress
195(2)
Stress--Strength Contour
197(1)
Common Issues
198(3)
Further Reading
201(2)
How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests
203(30)
E. Suhir
Introduction
203(1)
Some Major Definitions
204(1)
Engineering Reliability
204(1)
Field Failures
205(1)
Reliability is a Complex Property
206(1)
Three Major Classes of Engineering Products and Market Demands
206(2)
Reliability, Cost and Time-to-Market
208(1)
Reliability Costs Money
208(1)
Reliability Should Be Taken Care of on a Permanent Basis
209(1)
Ways to Prevent and Accommodate Failures
210(1)
Redundancy
211(1)
Maintenance and Warranty
211(1)
Test Types
212(1)
Accelerated Tests
212(1)
Accelerated Test Levels
213(1)
Qualification Standards
213(1)
Accelerated Life Tests (ALTs)
214(1)
Accelerated Test Conditions
215(1)
Acceleration Factor
216(1)
Accelerated Stress Categories
217(1)
Accelerated Life Tests (ALTs) and Highly Accelerated Life Tests (HALTs)
218(1)
Failure Mechanisms and Accelerated Stresses
219(1)
ALTs: Pitfalls and Challenges
219(1)
Burn-ins
220(1)
Wear-Out Failures
221(1)
Non-Destructive Evaluations (NDE's)
222(1)
Predictive Modeling
222(1)
Some Accelerated Life Test (ALT) Models
223(6)
Power Law
224(1)
Boltzmann-Arrhenius Equation
224(1)
Coffin-Manson Equation (Inverse Power Law)
225(1)
Paris-Erdogan Equation
226(1)
Bueche-Zhurkov Equation
227(1)
Eyring Equation
227(1)
Peck and Black Equations
227(1)
Fatigue Damage Model (Miner's Rule)
228(1)
Creep Rate Equations
228(1)
Weakest Link Models
228(1)
Stress-Strength Models
229(1)
Probability of Failure
229(1)
Conclusions
230(3)
References
230(3)
Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique
233(20)
Bernd Michel
Jurgen Keller
Introduction
233(1)
Basics of Digital Image Correlation
234(5)
Cross Correlation Algorithms on Gray Scale Images
234(2)
Subpixel Analysis for Enhanced Resolution
236(2)
Results of Digital Image Correlation
238(1)
Displacement and Strain Measurements on SFM Images
239(2)
Digital Image Correlation under SPM Conditions
239(2)
Technical Requirements for the Application of the Correlation Technique
241(1)
Deformation Analysis on Thermally and Mechanically Loaded Objects under the SFM
241(9)
Reliability Aspects of Sensors and Micro Electro-Mechanical Systems (MEMS)
241(1)
Thermally Loaded Gas Sensor under SFM
242(1)
Crack Detection and Evaluation by SFM
243(7)
Conclusion and Outlook
250(3)
References
250(3)
Interconnect Reliability Considerations in Portable Consumer Electronic Products
253(46)
Sridhar Canumalla
Puligandla Viswanadham
Introduction
253(2)
Reliability---Thermal, Mechanical and Electrochemical
255(12)
Accelerated Life Testing
255(2)
Thermal Environment
257(1)
Mechanical Environment
257(7)
Electrochemical Environment
264(3)
Tin Whiskers
267(1)
Reliability Comparisons in Literature
267(4)
Thermomechanical Reliability
268(2)
Mechanical Reliability
270(1)
Influence of Material Properties on Reliability
271(2)
Printed Wiring Board
271(1)
Package
272(1)
Surface Finish
272(1)
Failure Mechanisms
273(18)
Thermal Environment
273(3)
Mechanical Environment
276(10)
Electrochemical Environment
286(5)
reliability test Practices
291(3)
Summary
294(5)
Acknowledgments
295(1)
References
295(4)
MEMS Packaging and Reliability
299(24)
Y.C. Lee
Introduction
299(5)
Flip-Chip Assembly for Hybrid Integration
304(5)
Soldered Assembly for Three-Dimensional MEMS
309(4)
Flexible Circuit Boards for MEMS
313(3)
Atomic Layer Deposition for Reliable MEMS
316(4)
Conclusions
320(3)
Acknowledgments
320(1)
References
320(3)
Advances in Optoelectronic Methodology for MOEMS Testing
323(18)
Ryszard J. Pryputniewicz
Introduction
323(1)
MOEMS Samples
324(4)
Analysis
328(2)
Optoelectronic Methodology
330(4)
Representative Applications
334(4)
Conclusions and Recommendations
338(3)
Acknowledgments
339(1)
References
339(2)
Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study
341(20)
Ajay P. Malshe
Jay Narayan
High Efficiency Quantum Confined (Nanostructured) III-Nitride Based Light Emitting Diodes And Lasers
342(6)
Introduction
342(6)
Investigation of Reliability Issues in High Power Laser Diode Bar Packages
348(9)
Introduction
348(1)
Preparation of Packaged Samples for Reliability Testing
349(1)
Finding and Model of Reliability Results
350(7)
Conclusions
357(4)
Acknowledgments
358(1)
References
358(3)
Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board
361(22)
P. Misselbrook
D. Gwyer
C. Bailey
D. Gwyer
C. Bailey
P.P. Conway
K. Williams
Background to Optical Interconnects
362(1)
Transmission Equipment for Optical Interconnects
362(3)
Very Short Reach Optical Interconnects
365(1)
Free Space USR Optical Interconnects
366(1)
Guided Wave USR Interconnects
367(3)
Component Assembly of OECB's
370(3)
Computational Modeling of Optical Interconnects
373(7)
Conclusions
380(3)
Acknowledgments
380(1)
References
381(2)
Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics
383(20)
D.W. Dahringer
Introduction
383(2)
Use of Adhesives in Micro and Opto-Electronic Assemblies
383(1)
Specific Applications
384(1)
Adhesive Characteristics
385(8)
General Properties of Adhesives
385(5)
Adhesive Chemistry
390(3)
Design Objective
393(8)
Adhesive Joint Design
393(4)
Manufacturing Issues
397(4)
Failure Mechanism
401(2)
General
401(1)
Adhesive Changes
401(1)
Interfacial Changes
401(1)
Interfacial Stress
401(1)
External Stress
402(1)
References
402(1)
Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials
403(28)
Masaki Omiya
Kikuo Kishimoto
Wei Yang
Introduction
403(4)
Multi-Stage Peel Test (MPT)
407(6)
Testing Setup
407(1)
Multi-Stage Peel Test
408(1)
Energy Variation in Steady State Peeling
409(4)
Interfacial Adhesion Strength of Copper Thin Film
413(6)
Preparation of Specimen
413(1)
Measurement of Adhesion Strength by the MPT
414(1)
Discussions
415(4)
UV-Irradiation Effect on Ceramic/Polymer Interfacial Strength
419(7)
Preparation of PET/ITO Specimen
419(3)
Measurement of Interfacial Strength by MPT
422(2)
Surface Crack Formation on ITO Layer under Tensile Loading
424(2)
Concluding Remarks
426(5)
Acknowledgment
427(1)
References
427(4)
The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging
431(42)
Timothy P. Ferguson
Jianmin Qu
Introduction
432(1)
Moisture Transport Behavior
433(9)
Background
433(1)
Diffusion Theory
434(1)
Underfill Moisture Absorption Characteristics
435(3)
Moisture Absorption Modeling
438(4)
Elastic Modulus Variation Due to Moisture Absorption
442(7)
Background
442(2)
Effect of Moisture Preconditioning
444(3)
Elastic Modulus Recovery from Moisture Uptake
447(2)
Effect of Moisture on Interfacial Adhesion
449(24)
Background
449(2)
Interfacial Fracture Testing
451(1)
Effect of Moisture Preconditioning on Adhesion
452(9)
Interfacial Fracture Toughness Recovery from Moisture Uptake
461(1)
Interfacial Fracture Toughness Moisture Degradation Model
462(7)
References
469(4)
Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications
473(14)
E. Suhir
D. Ingman
Introduction
473(1)
Effect of the Interfacial Compliance on the interfacial Shearing Stress
474(2)
Internal Compressive Forces
476(1)
Advanced Nano-Particle Material (NPM)
476(2)
Highly-Compliant Nano-Systems
478(1)
Conclusions
479(8)
References
480(1)
Appendix 18.A: Bimaterial Assembly Subjected to an External Shearing Load and Change in Temperature: Expected Stress Relief due to the Elevated Interfacial Compliance
480(3)
Appendix 18.B: Cantilever Wire (``Beam'') Subjected at its Free End to a Lateral (Bending) and an Axial (Compressive) Force
483(2)
Appendix 18.C: Compressive Forces in the NPM-Based Compound Structure
485(2)
Adhesive Bonding of Passive Optical Components
487(40)
Anne-Claire Pliska
Christian Bosshard
Introduction
487(2)
Optical Devices and Assemblies
489(14)
Optical Components
489(1)
Opto-electronics Assemblies: Specific Requirements
489(14)
Adhesive Bonding in Optical Assemblies
503(15)
Origin of Adhesion
503(5)
Adhesive Selection and Dispensing
508(7)
Dispensing Technologies
515(3)
Some Applications
518(4)
Laser to Fiber Assembly
518(2)
Planar Lightwave Circuit (PLC) Pigtailing
520(2)
Summary and Recommendations
522(5)
Acknowledgments
523(1)
References
523(4)
Electrically Conductive Adhesives: A Research Status Review
527(44)
James E. Morris
Johan Liu
Introduction
527(2)
Technology Drivers
527(2)
Isotropic Conductive Adhesives (ICAs)
529(1)
Anisotropic Conductive Adhesives (ACAs)
529(1)
Non-Conductive Adhesive (NCA)
529(1)
Structure
529(5)
ICA
529(3)
ACA
532(2)
Modeling
534(1)
Materials and Processing
534(4)
Polymers
534(2)
ICA Filler
536(1)
ACA Processing
536(2)
Electrical Properties
538(8)
ICA
538(6)
Electrical Measurements
544(1)
ACA
544(2)
Mechanical Properties
546(7)
ICA
546(1)
ACA
547(6)
Thermal Properties
553(1)
Thermal Characteristics
553(1)
Maximum Current Carrying Capacity
553(1)
Reliability
554(11)
ICA
554(3)
ACA
557(8)
General Comments
565(1)
Environmental Impact
565(1)
Further Study
565(6)
References
565(6)
Electrically Conductive Adhesives
571(40)
Johann Nicolics
Martin Miindlein
Introduction and Historical Background
571(3)
Contact Formation
574(21)
Percolation and Critical Filler Content
574(1)
ICA Contact Model
575(3)
Results
578(17)
Aging Behavior and Quality Assessment
595(7)
Introduction
595(1)
Material Selection and Experimental Parameters
595(2)
Curing Parameters and Definition of Curing Time
597(1)
Testing Conditions, Typical Results, and Conclusions
598(4)
About Typical Applications
602(5)
ICA for Attachment of Power Devices
602(2)
ICA for Interconnecting Parts with Dissimilar Thermal Expansion Coefficient
604(2)
ICA for Cost-Effective Assembling of Multichip Modules
606(1)
Summary
607(4)
Notations and Definitions
607(1)
References
608(3)
Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging
611(18)
Grace Y. Li
C.P. Wong
Introduction
611(2)
Isotropic Conductive Adhesives (ICAs)
613(6)
Improvement of Electrical Conductivity of ICAs
614(1)
Stabilization of Contact Resistance on Non-Noble Metal Finishes
615(3)
Silver Migration Control of ICA
618(1)
Improvement of Reliability in Thermal Shock Environment
618(1)
Improvement of Impact Performance of ICA
619(1)
Anisotropic Conductive Adhesives (ACAs)/Anisotropic Conductive Film (ACF)
619(4)
Materials
620(1)
Application of ACA/ACF in Flip Chip
621(1)
Improvement of Electrical Properties of ACAs
621(2)
Thermal Conductivity of ACA
623(1)
Future Advances of ECAs
623(6)
Electrical Characteristics
623(1)
High Frequency Compatibility
623(1)
Reliability
623(2)
ECAs with Nano-filler for Wafer Level Application
625(1)
References
625(4)
Die Attach Quality Testing by Structure Function Evaluation
629(22)
Marta Rencz
Vladimir Szekely
Bernard Courtois
Nomenclature
629(1)
Greek symbols
629(1)
Subscripts
630(1)
Introduction
630(1)
Theoretical Background
630(4)
Detecting Voids in the Die Attach of Single Die Packages
634(2)
Simulation Experiments for Locating the Die Attach Failure on Stacked Die Packages
636(6)
Simulation Tests Considering Stacked Dies of the Same Size
637(2)
Simulation Experiments on a Pyramidal Structure
639(3)
Verification of the Methodology by Measurements
642(7)
Comparison of the Transient Behavior of Stacked Die Packages Containing Test Dies, Prior Subjected to Accelerated Moisture and Temperature Testing
642(2)
Comparison of the Transient Behavior of Stacked Die Packages Containing Real Functional Dies, Subjected Prior to Accelerated Moisture and Temperature Testing
644(5)
Conclusions
649(2)
Acknowledgments
649(1)
References
650(1)
Mechanical Behavior of Flip Chip Packages under Thermal Loading
651(26)
Enboa Wu
Shoulung Chen
C.Z. Tsai
Nicholas Kao
Introduction
651(1)
Flip Chip Packages
652(2)
Measurement Methods
654(2)
Phase Shifted Shadow Moire Method
654(1)
Electronic Speckle Pattern Interferometry (ESPI) Method
655(1)
Substrate CTE Measurement
656(5)
Behavior of Flip Chip Packages under Thermal Loading
661(7)
Warpage at Room Temperature
661(1)
Warpage at Elevated Temperatures
662(4)
Effect of Underfill on Warpage
666(2)
Finite Element Analysis of Flip Chip Packages under Thermal Loading
668(1)
Parametric Study of Warpage for Flip Chip Packages
669(5)
Change of the Chip Thickness
670(1)
Change of the Substrate Thickness
670(1)
Change of the Young's Modulus of the Underfill
671(1)
Change of the CTE of the Underfill
672(1)
Effect of the Geometry of the Underfill Fillet
672(2)
Summary
674(3)
References
674(3)
Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices
677(34)
Li Li
Yifan Guo
Dawei Zheng
Intrinsic Stress Due to Semiconductor Wafer Processing
677(8)
Testing Device Structure
678(1)
Membrane Deformations
679(2)
Intrinsic Stress
681(2)
Intrinsic Stress in Processed Wafer: Summary
683(2)
Die Stress Result from Flip-chip Assembly
685(13)
Consistent Composite Plate Model
685(2)
Free Thermal Deformation
687(1)
Bimaterial Plate (BMP) Case
688(3)
Validation of the Bimaterial Model
691(4)
Flip-Chip Package Design
695(2)
Die Stress in Flip Chip Assembly: Summary
697(1)
Thermal Stress Due to Temperature Cycling
698(5)
Finite Element Analysis
698(1)
Constitutive Equation for Solder
699(1)
Time-Dependent Thermal Stresses of Solder Joint
700(1)
Solder Joint Reliability Estimation
701(2)
Thermal Stress Due to Temperature Cycling: Summary
703(1)
Residual Stress in Polymer-based Low Dielectric Constant (low-k) Materials
703(8)
References
708(3)
Index 711


Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research, Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. He is currently on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA and the Department of Mechanical Engineering, University of Maryland, College Park, MD. Dr. Suhir is Fellow of the American Physical Society (APS), the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers (SPE). He is co-founder (with Dr. Peter Engel) of the ASME Journal of Electronic Packaging and served as its Technical Editor for eight years (1993-2001).   He has received numerous distinguished service and professional awards, including 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society; 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering; and 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering.









Prof. C. P. Wong is a Regents Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering at Georgia Institute of technology. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  He joined AT&T BellLaboratories in 1977 as a member of the technical staff and in 1992, he was elected as an AT&T Bell Laboratories Fellow for his fundamental contributions to low-cost high performance plastic packaging of semiconductors. Since 1996, he is a Professor at the School of Materials Science and Engineering at the Georgia Institute of Technology. He has received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996, 1998, 2002, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002 and the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006.  Dr. Wong is a Fellow of the IEEE, AIC, and AT&T Bell Labs, and was the technical vice president (1990 &1991), and the president of the IEEE-CPMT Society (1992 &1993). He was elected a member of the National Academy of Engineering in 2000.









Professor Y. C. Lee is a Professor of Mechanical Engineering. He was the Chair of ASME Electronic and Photonic Packaging Division (EPPD) from 2004 to 2005. From 1993 to 2002, he was an Associate Director of the Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, University of Colorado at Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey.  Dr. Lee was an Associated Editor of ASME Journal of Electronic Packaging from 2001 to 2004 and a Guest Editor for IEEE Transaction on Advanced Packaging in 2003 and 2005. He has received several awards: ASME Fellow, December 2002, Presidential Young Investigator (National Science Foundation, 1990), Outstanding Young Manufacturing Engineer Award (SME, 1992), Outstanding Paper Award (IEEE-ECTC, 1991), Outstanding Paper Award (ASME J. of Electronic Packaging, 1993), IEEE Transactions on Advanced Packaging Honorable Mention Paper Award, 2003