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El. knyga: Radiation Sensors with 3D Electrodes

(University of Trento, Italy), (University of Hawaii (retired), USA), (The University of Manchester, School of Physics and Astronomy, United Kingdom)
  • Formatas: 240 pages
  • Serija: Series in Sensors
  • Išleidimo metai: 17-Jan-2019
  • Leidėjas: CRC Press Inc
  • Kalba: eng
  • ISBN-13: 9780429619441
  • Formatas: 240 pages
  • Serija: Series in Sensors
  • Išleidimo metai: 17-Jan-2019
  • Leidėjas: CRC Press Inc
  • Kalba: eng
  • ISBN-13: 9780429619441

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Written by the leading names in this field, this book introduces the technical properties, design and fabrication details, measurement results, and applications of three-dimensional silicon radiation sensors. Such devices are currently used in the ATLAS experiment at the European Centre for Particle Physics (CERN) for particle tracking in high energy physics.

These sensors are the radiation hardest devices ever fabricated and have applications in ground-breaking research in neutron detection, medical dosimetry and space technologies and more. Chapters explore the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication, in addition to a providing historical overview of the field. This book will be a key reference for students and researchers working with sensor technologies.

Features:





The first book dedicated to this unique and growing subject area, which is also widely applicable in high-energy physics, medical physics, space science and beyond Authored by Sherwood Parker, the inventor of the concept of 3D detectors; Cinzia Da Vią, who has brought 3DSi technology to application; and Gian-Franco Dalla Betta, a leading figure in the design and fabrication technology of these devices Explains to non-experts the essential features of silicon particle detectors, interactions of radiation with matter, radiation damage effects, and micro-fabrication
About the Authors xi
Acknowledgments xiii
Chapter 1 Introduction
1(4)
Chapter 2 Silicon Radiation Sensors
5(32)
2.1 Introduction
5(2)
2.2 Interaction Of Radiation With Silicon
7(6)
2.2 Charged Particles
7(3)
2.2 Photons
10(1)
2.2.2.1 Photon Energy Close to the Energy Gap
10(1)
2.2.2.2 Photon Energy Much Higher Than the Energy Gap
11(2)
2.2 Neutrons
13(1)
2.3 Semiconductor Physics
13(6)
2.3 Silicon as a Detector Material
13(1)
2.3 The p-n Junction in Reverse Bias
14(5)
2.4 Position-Sensitive Sensors
19(4)
2.4 Pad (Diode)
19(1)
2.4 Strip Sensors
20(1)
2.4 Pixel Sensors
21(1)
2.4 Drift Detector
22(1)
2.5 Signal Formation
23(7)
2.5 Charge Motion
23(1)
2.5 Induced Signals
24(6)
2.6 Readout Electronics And Noise
30(7)
2.6 Energy Resolution
30(2)
2.6 Electronic Noise
32(5)
Chapter 3 Radiation Effects in Silicon Sensors
37(24)
3.1 Introduction
37(1)
3.2 Radiation Damage In Silicon
37(15)
3.2 Surface Damage
38(2)
3.2 Bulk Damage
40(12)
3.3 Can Radiation Damage Be Controlled?
52(9)
3.3 Surface Damage
52(1)
3.3 Bulk Damage
53(8)
Chapter 4 3D Sensors
61(32)
4.1 Basic Concept
61(4)
4.2 Device Simulations
65(3)
4.3 Experimental results
68(2)
4.4 Alternative 3D Designs
70(11)
4.4 Single-Type-Column 3D Detectors
70(4)
4.4 Double-Sided Double-Type-Column 3D Detectors
74(5)
4.4 Trenched Electrodes
79(1)
4.4 The Pixelated Vertical Drift Detector
80(1)
4.4 Dual Readout in 3D Sensors
81(1)
4.5 Active And Slim Edges In 3D Sensors
81(12)
Chapter 5 Fabrication Technologies
93(26)
5.1 General Aspects Of Silicon Detector Processing
93(9)
5.1 Materials
94(2)
5.1 Technological Aspects
96(1)
5.1.2.1 Passivation Oxide Deposition
96(1)
5.1.2.2 Silicon Nitride and Polysilicon Deposition
97(1)
5.1.2.3 Junction Fabrication
98(1)
5.1.2.4 Etching and Metallization
99(1)
5.1.2.5 Gettering
100(2)
5.2 Deep Etching Techniques
102(1)
5.2 Deep Reactive Ion Etching
102(1)
5.2 Other Etching Techniques
103(1)
5.3 Full 3D Detectors With Active Edge
103(4)
5.4 Alternative Approaches
107(4)
5.5 Recent Developments
111(8)
Chapter 6 Radiation Hardness in 3D Sensors
119(26)
6.1 Introduction
119(3)
6.2 Some History: Initial Irradiation Tests
122(4)
6.3 Devices With A Different Electrode Configuration
126(3)
6.4 Radiation Hardness Of 3D-STC (Or Semi-3d) Detectors (FBK, VTT)
129(2)
6.5 Radiation Hardness Of 3d-DDTC Detectors (FBK, CNM)
131(14)
Chapter 7 The Industrialization Phase
145(14)
7.1 Introduction
145(1)
7.2 Design Specifications And Common Wafer Layout
146(3)
7.3 Sensor Electrical Specifications
149(1)
7.4 Prototype Fabrication And Ibl Sensor Production Strategy
150(1)
7.5 Experimental Results
151(5)
7.6 Lessons Learned
156(3)
Chapter 8 Planar Active-Edge Sensors
159(18)
8.1 Introduction
159(1)
8.2 Different Approaches To Edgeless Sensors
160(1)
8.2 Early Attempts
160(1)
8.2 The Scribe-Cleave-Passivate Technique
160(1)
8.3 Active-Edge Technologies
161(3)
8.4 Results
164(7)
8.5 Alternative Solutions For Slim Edges
171(6)
Chapter 9 Applications
177(22)
9.1 High-Energy Physics
177(3)
9.2 3D Speed Properties
180(3)
9.3 Medical Imaging
183(3)
9.4 Protein Crystallography And Microdosimetry
186(1)
9.5 Neutron Detectors
187(2)
9.6 Vertically Integrated Systems With Microchannel Cooling
189(3)
9.7 Multiband Spectroscopy
192(1)
9.8 3D Sensors With Other Substrates
192(7)
Appendix: Silicon Detectors: A Partial History 199(20)
Index 219
Cinzia Da Vią is a Professor of Physics at the University of Manchester UK, and currently a visiting Professor at Stony Brook University USA. She received her PhD in Physics from the University of Glasgow, Scotland in 1997 and is an expert in semiconductor detector development for High-Energy Physics and Medical applications where she authored more than 300 papers of which several on the evaluation of the first 3D sensors prototypes ever fabricated. Member of the ATLAS Experiment at the CERN Large Hadron Collider since 2007, she was the founder and leader of the 3D ATLAS pixel R&D Collaboration (2007-2014), which successfully designed and industrialized the first 3D sensors to be installed in a Collider. 3Ds are successfully operating in the ATLAS experiment since 2014. She is currently involved in novel 3D sensors designs, 3D printed dosimetry, quantum imaging and vertical integration of smart-systems. She is one of the founders of the ERDIT Network to promote Radiation Imaging Technology research across different applications in Europe and a member of the Independent Committee of the ATTRACT initiative, which funds innovative technologies in the field of radiation detection and imaging across Europe.

Gian-Franco Dalla Betta is a Full Professor of Electronics at the University of Trento, Italy. Born in Venice, Italy, in 1967. He received the M.S. degree in electronics engineering from the University of Bologna, Italy, in 1992 and the Ph.D. in microelectronics from the University of Trento, Italy, in 1997. Since 1997 to 2002, he was with the Institute for Scientific and Technological Research (ITC-IRST) of Trento, Italy, as a Researcher and since November 2002, he moved to the University of Trento. His main research expertise is in design, simulation, fabrication and experimental characterization of silicon integrated devices and circuits, with emphasis on radiation sensors and 3D sensors of which he was among the first to design a double-sided layout. On these and related topics he has been the author or co-author of more than 350 papers published in international journals and conference proceedings. As a member of the 3D ATLAS R&D Collaboration from the start he coordinated the design of the 3D pixel sensors that are now installed in the ATLAS Insertable B-Layer at the CERN Large Hadron Collider (LHC), the first application of this technology in a High-Energy-Physics experiment. His current activities include the development of new 3D sensor designs for neutron and fast timing applications and the coordination of the Italian R&D effort aimed at a new generation of 3D sensors for the Phase 2 Upgrades of the ATLAS and CMS projects at the High Luminosity LHC.

Sherwood Ira Parker (1932 2018) was a pioneer in experimental physics. He developed the first scientific silicon readout integrated circuit (Microplex), the first monolithic charged particle sensors, and the first 3D silicon detectors used to prove the existence of the Higgs Boson particle. He collaborated with many leading research scientists and laboratories around the world including CERN, FERMI and SLAC. Dr. Parker also developed detectors for use in digital mammography and held seven patents. These achievements were recognized when he was awarded the Glenn Knoll Radiation Instrumentation Outstanding Achievement Award in 2015 from the IEEE Nuclear and Plasma Sciences Society. And despite severe mobility impairments caused by ALS, he continued contributing to key innovative work on high-speed signals with 3D radiation detectors.