Acknowledgment |
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ix | |
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xi | |
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xix | |
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xxi | |
Introduction: The Idea of This Book |
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1 | (6) |
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7 | (40) |
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1.1 Measuring the Temperature |
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7 | (9) |
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1.1.1 Thermoelectric Effect (Seebeck Effect) |
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8 | (5) |
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1.1.2 Thermoresistive Effect |
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13 | (2) |
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1.1.3 Pyroelectric Effect |
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15 | (1) |
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1.2 Radiation Thermometer |
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16 | (19) |
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1.2.1 Static Modeling of Thermal Transport and Understanding Sensitivity |
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20 | (4) |
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1.2.2 Modeling Dynamic Behavior |
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24 | (4) |
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1.2.3 The Noise of the Thermopile |
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28 | (4) |
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1.2.4 Sensor Electronics: Building the System |
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32 | (1) |
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1.2.5 The Alternatives: Pyroelectric Sensor and Bolometer |
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33 | (2) |
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1.3 A Topical Application Example: Infrared Gas Sensing of Ethylene |
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35 | (3) |
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1.4 Important Terms and Definitions for Sensor Characterization |
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38 | (3) |
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1.5 Excursus to Wireless Sensor Networks |
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41 | (4) |
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45 | (2) |
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47 | (48) |
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2.1 Basics of Microtechnology |
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47 | (2) |
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49 | (15) |
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2.2.1 Silicon as a Substrate |
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49 | (1) |
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49 | (4) |
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2.2.3 Thin-Film Deposition Methods: An Overview |
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53 | (1) |
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2.2.4 Physical Vapor Deposition (PVD) |
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53 | (6) |
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2.2.5 Chemical Vapor Deposition (CVD) |
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59 | (3) |
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2.2.6 Oxidation of Silicon |
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62 | (1) |
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2.2.7 Surface Migration and Step Coverage |
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63 | (1) |
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2.3 Thin-Film Deposition Control |
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64 | (4) |
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2.3.1 Metal Films: Measuring Sheet Resistance |
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65 | (1) |
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2.3.2 Dielectric Films: Interferometers |
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66 | (2) |
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68 | (1) |
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68 | (2) |
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2.4.1 Silicon Fusion Bonding |
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68 | (1) |
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69 | (1) |
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70 | (13) |
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70 | (4) |
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2.5.2 Etching Fundamentals |
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74 | (2) |
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2.5.3 Anisotropic Wet Etching of Silicon |
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76 | (3) |
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79 | (4) |
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2.6 The Thermopile Process |
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83 | (7) |
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2.7 The Recent Trend: Flexible Structures and Polymer MEMS |
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90 | (4) |
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94 | (1) |
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3 Force and Pressure Sensors |
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95 | (48) |
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3.1 The Piezoresistive Effect |
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95 | (3) |
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3.2 Strain Gauges and Force Sensing |
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98 | (1) |
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3.3 Pressure Sensors: Dimensions, Ranges and Applications |
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99 | (3) |
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3.4 Piezoresistive Pressure Sensors |
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102 | (4) |
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3.4.1 Steel Membrane Sensors |
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102 | (3) |
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3.4.2 Silicon Membrane Sensors |
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105 | (1) |
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3.5 From the Wafer to the System - Technology of the Silicon Pressure Sensor |
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106 | (23) |
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106 | (3) |
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3.5.2 Electric Test Structures |
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109 | (4) |
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3.5.3 Mounting and Housing Technology |
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113 | (2) |
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3.5.4 Integrating MEMS and Electronics |
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115 | (3) |
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3.5.5 Example of a Commercial Pressure Sensor |
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118 | (3) |
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121 | (5) |
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126 | (1) |
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3.5.8 System Test, Reliability and Failure Modes |
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127 | (2) |
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3.6 Capacitive Pressure Sensors |
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129 | (5) |
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3.7 The Recent Trend: Additive Technology and Printed Sensors |
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134 | (7) |
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141 | (2) |
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143 | (34) |
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4.1 Inertial Measurement of Motion |
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143 | (1) |
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144 | (13) |
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4.2.1 Applications and Ranges |
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144 | (3) |
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4.2.2 Sensor Principles and Resonance |
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147 | (3) |
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4.2.3 Layout and Technology |
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150 | (3) |
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4.2.4 Accelerometer Electronics |
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153 | (2) |
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4.2.5 Resolution and Noise |
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155 | (2) |
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157 | (18) |
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4.3.1 Applications and Ranges |
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158 | (2) |
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4.3.2 Sensor Idea and Coriolis Force |
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160 | (1) |
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161 | (7) |
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168 | (3) |
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171 | (2) |
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4.3.6 Inertial Measurement Units (IMU) and Sensor Fusion |
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173 | (2) |
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175 | (2) |
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177 | (16) |
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5.1 Dimensions, Ranges and Applications |
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177 | (1) |
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178 | (3) |
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5.3 The Resistive Hall Probe |
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181 | (1) |
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5.4 The Giant Magnetoresistive Effect |
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182 | (2) |
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5.5 The Tunneling Magnetoresistive Sensor |
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184 | (3) |
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187 | (4) |
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191 | (2) |
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193 | (22) |
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6.1 Ranges and Applications |
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193 | (2) |
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6.2 Types of Flow Sensors |
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195 | (1) |
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6.3 Pressure Sensors for Flow Measurement |
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195 | (3) |
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198 | (3) |
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6.5 Electromagnetic Flow Sensor |
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201 | (1) |
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202 | (11) |
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202 | (1) |
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6.6.2 The Mass Flow Controller |
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203 | (1) |
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6.6.3 Thermal Membrane Flow Sensors |
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204 | (4) |
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6.6.4 Modeling of the Thermal Anemometer |
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208 | (5) |
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213 | (2) |
Index |
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215 | (6) |
About the Author |
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221 | |