Papers from the title symposium at the November 1995 congress apply theoretical and experimental methods of structural analysis to various mechanical and materials science problems in microelectronics and fiber optics and represent the current state of knowledge in the area of mechanical (physical) design of electronic and photonic packages. Subjects include design methodology for filled polymer systems; random change of vibration modes in thermosonic bonding; plastic bending analysis; the effects of voids on stress in epoxy material; and high temperature creep properties of liquid crystal polymers. No index. Annotation copyright Book News, Inc. Portland, Or.
