"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"--
"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"--
Provided by publisher.
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
| Preface |
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vii | |
| Contributors |
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ix | |
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1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems |
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1 | (18) |
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2 Linear Response to Shocks and Vibrations |
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19 | (16) |
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3 Linear and Nonlinear Vibrations Caused by Periodic Impulses |
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35 | (18) |
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4 Random Vibrations of Structural Elements in Electronic and Photonic Systems |
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53 | (22) |
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5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations |
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75 | (60) |
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6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling |
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135 | (24) |
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7 Shock Test Methods and Test Standards for Portable Electronic Devices |
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159 | (16) |
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8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock |
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175 | (8) |
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9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment |
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183 | (12) |
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10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy |
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195 | (60) |
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11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
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255 | (22) |
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12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration |
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277 | (32) |
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13 Vibration Considerations for Sensitive Research and Production Facilities |
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309 | (18) |
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14 Applications of Finite Element Analysis: Attributes and Challenges |
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327 | (10) |
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15 Shock Simulation of Drop Test of Hard Disk Drives |
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337 | (20) |
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16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW) |
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357 | (14) |
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17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads |
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371 | (44) |
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18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests |
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415 | (20) |
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19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? |
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435 | (14) |
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20 Shock Isolation of Micromachined Device for High-g Applications |
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449 | (36) |
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21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods |
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485 | (34) |
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22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies |
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519 | (56) |
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23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse? |
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575 | (14) |
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| Index |
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589 | |
Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine; cofounder of the ASME Journal of Electronic Packaging; holds twenty-two U.S. patents; and has authored about 300 technical publications (papers, book chapters, books). Dr. Suhir has received many professional awards, including the 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award; 2000 SPE International Engineering/Technology Award for contributions to plastics engineering; 1999 ASME Charles Russ Richards Memorial Award for contributions to mechanical engineering; and 1996 Bell Laboratories Distinguished Member of Technical Staff Award for developing engineering mechanics methods for predicting the reliability, performance, and mechanical behavior of complex structures. DAVID S. STEINBERG is associated with the University of California, Los Angeles, Extension and also at the University of Wisconsin-Extension. He retired from Litton GCS (now Northrop Grumman) after serving as their director of engineering. He is the author of seven popular textbooks related to the design, analysis, testing, and evaluation of sophisticated electronic equipment for reliable operation in severe vibration, shock, thermal, thermal cycling, acoustic, and pyrotechnic shock environments. His most popular textbooks are Vibration Analysis for Electronic Equipment, Cooling Techniques for Electronic Equipment, and Preventing Thermal Cycling and Vibration Failures in Electronic Equipment, published by Wiley. Dr. Steinberg is currently the President of Steinberg & Associates and has presented seminars, workshops, and consulted for many of the major suppliers of electronics components and equipment such as General Electric, General Motors, Intel, Cisco, Texas Instruments, Microsoft, Harris, Honeywell, Raytheon, Westinghouse, and many others.
T. X. YU is Professor Emeritus of Mechanical Engineering at the Hong Kong University of Science and Technology (HKUST). After graduating from Peking University, he got his PhD and ScD from Cambridge University. After teaching at Peking University and UMIST, he joined HKUST in 1995. Before his retirement in July 2010, he was chair professor of mechanical engineering, associate vice-president (R&D), and dean of Fok Ying Tung Graduate School at HKUST. His research interests include impact dynamics, plasticity, energy absorption, textile and cellular materials, and nano-composites. He has published three textbooks, three scientific monographs, 310 journal papers, 170 international conference papers, and four patents. He serves as Associate Editor for the International Journal of Impact Engineering and International Journal of Mechanical Sciences. He is a Fellow of ASME, IMechE, and HKIE.
