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VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 1618, 2023, Revised Extended Selected Papers 2024 ed. [Kietas viršelis]

  • Formatas: Hardback, 320 pages, aukštis x plotis: 235x155 mm, 126 Illustrations, color; 44 Illustrations, black and white; XII, 320 p. 170 illus., 126 illus. in color., 1 Hardback
  • Serija: IFIP Advances in Information and Communication Technology 680
  • Išleidimo metai: 29-Dec-2024
  • Leidėjas: Springer International Publishing AG
  • ISBN-10: 3031709462
  • ISBN-13: 9783031709463
Kitos knygos pagal šią temą:
  • Formatas: Hardback, 320 pages, aukštis x plotis: 235x155 mm, 126 Illustrations, color; 44 Illustrations, black and white; XII, 320 p. 170 illus., 126 illus. in color., 1 Hardback
  • Serija: IFIP Advances in Information and Communication Technology 680
  • Išleidimo metai: 29-Dec-2024
  • Leidėjas: Springer International Publishing AG
  • ISBN-10: 3031709462
  • ISBN-13: 9783031709463
Kitos knygos pagal šią temą:

This book contains revised and extended versions of a selection of  papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, 2023.
The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy -  and is representing cutting-edge research at the forefront of VLSI technology.

Architectures.- Synthesis of SFQ Circuits with Compound Gates.-
Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM
Architectures.- A Leap of Confidence: A Write-Intensity aware Prudent Page
Migration for Hybrid Memories.- Efficient Depth Optimization in Quantum
Addition and Modular Arithmetic with Ling Structure.- Accelerators.-
Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power
and Flexibility.- Accelerating Large Kernel Convolutions with Nested Winograd
Transformation.- A Unified and Energy-Efficient Depthwise Separable
Convolution Accelerator.- Resiliency and Robustness .- Analyzing the
Reliability of TCUs Through Micro-architecture and Structural Evaluations for
Two Real Number Formats.- Advanced Quality Assurance Platform for Robust
Process Design Kits.- FPGA-Implementation Techniques to Efficiently Test
Application Readiness of Mixed-Signal Products.- Radiation Tolerant 14T SRAM
Cell for Avionics Applications.- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion
Time-Domain ADC for Backplane Interconnect.-Security and Privacy.- Enhancing
HW-SW Confidentiality Verification for Embedded Processors with SoftFlows
Advanced Memory Range Feature.- Confidential Inference in Decision Trees.-
Enhancing the Security of IJTAG network using Inherently Secure SIB.