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Wafer Bonding: Applications and Technology 2004 ed. [Kietas viršelis]

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  • Formatas: Hardback, 504 pages, aukštis x plotis: 235x155 mm, weight: 1035 g, 20 Illustrations, color; 363 Illustrations, black and white; XV, 504 p. 383 illus., 20 illus. in color., 1 Hardback
  • Serija: Springer Series in Materials Science 75
  • Išleidimo metai: 14-May-2004
  • Leidėjas: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • ISBN-10: 3540210490
  • ISBN-13: 9783540210498
Kitos knygos pagal šią temą:
Wafer Bonding: Applications and Technology 2004 ed.Didesnis paveikslėlis
  • Formatas: Hardback, 504 pages, aukštis x plotis: 235x155 mm, weight: 1035 g, 20 Illustrations, color; 363 Illustrations, black and white; XV, 504 p. 383 illus., 20 illus. in color., 1 Hardback
  • Serija: Springer Series in Materials Science 75
  • Išleidimo metai: 14-May-2004
  • Leidėjas: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • ISBN-10: 3540210490
  • ISBN-13: 9783540210498
Kitos knygos pagal šią temą:
Pastovi nuoroda: https://www.kriso.lt/db/9783540210498.html
Raktažodžiai:
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Recenzijos

From the reviews:









"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)

1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A
Historical Patent Picture of the Worldwide Moving Front of the
State-of-the-Art of Contact Bonding.- 2 Basics of Silicon-on-Insulator (SOI)
Technology.- 3 Silicon-on-Insulator by the Smart CutTM Process.- 4 ELTRAN®
Technology Based on Wafer Bonding and Porous Silicon.- 5 Wafer Bonding for
High-Performance Logic Applications.- 6 Application of Bonded Wafers to the
Fabrication of Electronic Devices.- 7 Compound Semiconductor Heterostructures
by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs
Heterostructures on Silicon.- 8 Three-Dimensional Photonic Bandgap Crystals
by Wafer Bonding Approach.- 9 Wafer Direct Bonding for High-Brightness
Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- 10
High-Density Hybrid Integration of IIIV Compound Optoelectronics with
Silicon Integrated Circuits.- 11 Layer Transfer by Bonding and Laser
Lift-Off.- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.-
13 Wafer Bonding of Ferroelectric Materials.- 14 Debonding of Wafer-Bonded
Interfaces for Handling and Transfer Applications.