Ši knyga nebeleidžiama, tačiau mes Jums pranešime naudoto egzemplioriaus kainą
This volume offers a broad spectrum of technical contributions in diverse areas of microelectronics interconnection and packaging technologies. Topics include: materials; flip chip/interconnection technologies; optical components and modules; and th...Daugiau...
This volume covers topics including: multichip modules; micro/chip scale packaging; advanced PWBs; portables and IC packaging; MCM thermal management; modern wirebonding technology; polymers for electronic packaging; and materials, processes and rel...Daugiau...
Ši knyga nebeleidžiama, tačiau mes Jums pranešime naudoto egzemplioriaus kainą
Designed for manufacturing engineers and product designers, this conference provides the latest developments in the field of polymeric electronic packaging....Daugiau...
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufac...Daugiau...
This conference provides a broad view of the diverse arena of innovation. From this perspective, a variety of approaches under investigation and development is assessed. The focus is on many aggressive extensions of circuit and packaging technologie...Daugiau...
